Global Patent Index - EP 3772520 B1

EP 3772520 B1 20230712 - POLYAMIDE MOULDING COMPOUND AND USE THEREOF AND MOULDED BODIES PRODUCED FROM SAID MOULDING COMPOUND

Title (en)

POLYAMIDE MOULDING COMPOUND AND USE THEREOF AND MOULDED BODIES PRODUCED FROM SAID MOULDING COMPOUND

Title (de)

POLYAMID-FORMMASSE UND DEREN VERWENDUNG SOWIE AUS DER FORMMASSE HERGESTELLTE FORMKÖRPER

Title (fr)

MASSE DE FORMAGE EN POLYAMIDE ET SON UTILISATION, AINSI QUE CORPS MOULÉ FABRIQUÉ À PARTIR DE LA MASSE DE FORMAGE

Publication

EP 3772520 B1 20230712 (DE)

Application

EP 19191017 A 20190809

Priority

EP 19191017 A 20190809

Abstract (en)

[origin: CN112341810A] The present invention relates to polyamide moulding compounds that contain a semi-crystalline copolyamide, at least one filler, and optionally additives. The invention likewise relates to mouldings manufacture from these moulding compounds and to the use of the moulding compounds to manufacture mouldings.

IPC 8 full level

C08G 69/26 (2006.01); C08K 3/014 (2018.01); C08K 3/04 (2006.01); C08K 3/34 (2006.01); C08K 7/14 (2006.01)

CPC (source: CN EP KR US)

C08G 69/265 (2013.01 - EP KR); C08K 3/013 (2018.01 - KR); C08K 3/04 (2013.01 - CN); C08K 3/34 (2013.01 - CN); C08K 3/346 (2013.01 - CN); C08K 5/1345 (2013.01 - CN); C08K 7/14 (2013.01 - CN); C08L 77/06 (2013.01 - KR US); C08K 3/014 (2018.01 - EP); C08K 3/34 (2013.01 - EP); C08K 3/346 (2013.01 - EP); C08K 7/14 (2013.01 - EP)

C-Set (source: CN EP)

CN

  1. C08K 7/14 + C08L 77/06
  2. C08K 5/1345 + C08L 77/06
  3. C08K 3/04 + C08L 77/06
  4. C08K 3/346 + C08L 77/06
  5. C08K 3/34 + C08L 77/06

EP

  1. C08K 7/14 + C08L 77/06
  2. C08K 3/34 + C08L 77/06
  3. C08K 3/014 + C08L 77/06
  4. C08K 3/346 + C08L 77/06

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 3772520 A1 20210210; EP 3772520 B1 20230712; EP 3772520 C0 20230712; CN 112341810 A 20210209; CN 112341810 B 20240510; JP 2021042354 A 20210318; KR 20210018776 A 20210218; MX 2020008316 A 20210210; US 11453778 B2 20220927; US 2021040317 A1 20210211

DOCDB simple family (application)

EP 19191017 A 20190809; CN 202010794866 A 20200810; JP 2020132931 A 20200805; KR 20200099046 A 20200807; MX 2020008316 A 20200807; US 202016988011 A 20200807