EP 3774154 A1 20210217 - HOMOGENEOUS COOLING FOR WELDING PROCESSES, IN PARTICULAR WAAM
Title (en)
HOMOGENEOUS COOLING FOR WELDING PROCESSES, IN PARTICULAR WAAM
Title (de)
HOMOGENE KÜHLUNG FÜR SCHWEISSVERFAHREN, INSBESONDERE WAAM
Title (fr)
REFROIDISSEMENT HOMOGÈNE POUR PROCÉDÉ DE SOUDAGE, EN PARTICULIER PROCÉDÉ DE FABRICATION ADDITIVE ARC-FIL
Publication
Application
Priority
- DE 102018002815 A 20180406
- EP 18020386 A 20180814
- EP 2019025076 W 20190325
Abstract (en)
[origin: WO2019192755A1] The invention relates to a welding process for producing a component (10) by depositing multiple layers (100) of a metal material in layers, said layers lying one on top of the other. In said process, the base (10a) of the component (10) is placed in a liquid coolant (6) such that the coolant contacts the base (6), and a surface (10b) of the base (6) lies above the coolant level (3). A first layer (100) of the material is deposited onto the surface (10b) by welding the material to the surface (10b), and each subsequent layer (100) is deposited onto a temporary component surface (10bb) formed by the previously deposited layer (100) by welding the material to the temporary component surface (10bb), wherein the heat resulting from welding the material is absorbed by the coolant (6). The invention additionally relates to a device (1) for carrying out the method.
IPC 8 full level
B23K 11/00 (2006.01); B23K 9/04 (2006.01); B23K 26/342 (2014.01); B23K 37/00 (2006.01)
CPC (source: EP US)
B23K 9/042 (2013.01 - EP); B23K 11/0013 (2013.01 - EP); B23K 26/342 (2015.10 - EP); B23K 37/003 (2013.01 - EP US); B33Y 10/00 (2014.12 - US); B33Y 30/00 (2014.12 - US)
Citation (search report)
See references of WO 2019192755A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3549708 A1 20191009; CN 111936258 A 20201113; DE 102018002815 A1 20191010; EP 3774154 A1 20210217; US 2021162552 A1 20210603; WO 2019192755 A1 20191010
DOCDB simple family (application)
EP 18020386 A 20180814; CN 201980024592 A 20190325; DE 102018002815 A 20180406; EP 19712905 A 20190325; EP 2019025076 W 20190325; US 201917045239 A 20190325