EP 3776635 A1 20210217 - CLEAVABLE ADDITIVES FOR USE IN A METHOD OF MAKING A SEMICONDUCTOR SUBSTRATE
Title (en)
CLEAVABLE ADDITIVES FOR USE IN A METHOD OF MAKING A SEMICONDUCTOR SUBSTRATE
Title (de)
SPALTBARE ADDITIVE ZUR VERWENDUNG IN EINEM VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERSUBSTRATS
Title (fr)
ADDITIFS CLIVABLES DESTINÉS À ÊTRE UTILISÉS DANS UN PROCÉDÉ DE FABRICATION D'UN SUBSTRAT SEMI-CONDUCTEUR
Publication
Application
Priority
- EP 18165603 A 20180404
- EP 2019058247 W 20190402
Abstract (en)
[origin: WO2019192990A1] The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.
IPC 8 full level
H01L 21/321 (2006.01)
CPC (source: EP KR US)
C07C 271/12 (2013.01 - US); C11D 1/02 (2013.01 - KR); C11D 1/62 (2013.01 - KR); C11D 1/88 (2013.01 - KR); H01L 21/02057 (2013.01 - EP KR US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2019192990 A1 20191010; CN 111937121 A 20201113; CN 111937121 B 20231208; EP 3776635 A1 20210217; EP 3776635 B1 20221207; KR 20200139192 A 20201211; TW 201942106 A 20191101; TW I823922 B 20231201; US 11742197 B2 20230829; US 2021166934 A1 20210603
DOCDB simple family (application)
EP 2019058247 W 20190402; CN 201980023418 A 20190402; EP 19713512 A 20190402; KR 20207030926 A 20190402; TW 108111903 A 20190403; US 201917044928 A 20190402