EP 3778069 A4 20220406 - COPPER PASTE, BONDING METHOD, AND METHOD FOR PRODUCING BONDED BODY
Title (en)
COPPER PASTE, BONDING METHOD, AND METHOD FOR PRODUCING BONDED BODY
Title (de)
KUPFERPASTE, VERBINDUNGSVERFAHREN UND VERFAHREN ZUR HERSTELLUNG EINES GEBUNDENEN KÖRPERS
Title (fr)
PÂTE AU CUIVRE, PROCÉDÉ DE COLLAGE ET PROCÉDÉ DE PRODUCTION DE CORPS COLLÉ
Publication
Application
Priority
- JP 2018065201 A 20180329
- JP 2019011213 W 20190318
Abstract (en)
[origin: EP3778069A1] This copper paste includes metal particles and a dispersion medium. The metal particles includes first-type particles and second-type particles. The first-type particles are copper particles having nanostructures on the surfaces thereof, and having an average particle diameter of 1 to 100 µm. The second-type particles are copper particles having an average particle diameter of 0.05 to 5 µm. The average particle diameter of the first-type particles is 2 to 550 times the average particle diameter of the second-type particles. For example, a laminate, in which a copper paste (5) is disposed between a first member (1) and a second member (2), is heated in a reducing atmosphere to sinter the copper paste, whereby the first member and the second member can be bonded without pressurizing.
IPC 8 full level
B22F 1/052 (2022.01); B22F 1/07 (2022.01); B22F 1/107 (2022.01); B22F 1/145 (2022.01); B22F 1/16 (2022.01); B22F 7/04 (2006.01); H01B 1/22 (2006.01)
CPC (source: EP US)
B22F 1/052 (2022.01 - EP US); B22F 1/07 (2022.01 - EP US); B22F 1/107 (2022.01 - EP US); B22F 1/145 (2022.01 - EP US); B22F 1/16 (2022.01 - EP US); B22F 7/04 (2013.01 - EP); H01B 1/22 (2013.01 - EP US); B22F 2007/047 (2013.01 - EP); B22F 2999/00 (2013.01 - EP)
Citation (search report)
- [XA] JP 2011094236 A 20110512 - DOWA HOLDINGS CO LTD
- [XA] JP 2005298903 A 20051027 - DOWA MINING CO
- [XA] JP 2017103180 A 20170608 - HITACHI CHEMICAL CO LTD
- [XA] US 7368070 B2 20080506 - AKIMOTO YUJI [JP], et al
- See references of WO 2019188511A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3778069 A1 20210217; EP 3778069 A4 20220406; JP 2022046765 A 20220323; JP 7220310 B2 20230209; JP WO2019188511 A1 20201203; TW 201942372 A 20191101; TW I798404 B 20230411; WO 2019188511 A1 20191003
DOCDB simple family (application)
EP 19775134 A 20190318; JP 2019011213 W 20190318; JP 2020510704 A 20190318; JP 2022001819 A 20220107; TW 108111208 A 20190329