Global Patent Index - EP 3779325 B1

EP 3779325 B1 20230111 - HEAT PUMP SYSTEM

Title (en)

HEAT PUMP SYSTEM

Title (de)

WÄRMEPUMPENSYSTEM

Title (fr)

SYSTÈME DE POMPE À CHALEUR

Publication

EP 3779325 B1 20230111 (EN)

Application

EP 19785252 A 20190405

Priority

  • JP 2018077903 A 20180413
  • JP 2019015135 W 20190405

Abstract (en)

[origin: EP3779325A1] A decrease in the heating capacity for a fluid to be heated in a radiator is prevented by thermal conduction via a joint portion between an economizer and the radiator in an integral heat exchanger.A heat pump system (1) includes a refrigerant circuit (10) constituted by connecting a compressor (11), a radiator (12), an expansion mechanism (13), an evaporator (14), and an economizer (22). In this case, the economizer (22) constitutes an integral heat exchanger (20) in which the economizer (22) and the radiator (12) are integrated with each other. Moreover, the integral heat exchanger (20) includes a heat insulating part (44) between the economizer (22) and the radiator (12).

IPC 8 full level

F25B 1/00 (2006.01); F25B 1/10 (2006.01); F25B 30/02 (2006.01); F25B 39/00 (2006.01); F25B 40/02 (2006.01)

CPC (source: EP)

F25B 1/00 (2013.01); F25B 1/10 (2013.01); F25B 30/02 (2013.01); F25B 39/00 (2013.01); F25B 40/02 (2013.01); F25B 2339/047 (2013.01); F25B 2400/13 (2013.01); F25B 2500/11 (2013.01); F25B 2500/18 (2013.01)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

EP 3779325 A1 20210217; EP 3779325 A4 20210609; EP 3779325 B1 20230111; CN 111954786 A 20201117; CN 111954786 B 20220923; JP 2019184193 A 20191024; JP 7092997 B2 20220629; WO 2019198638 A1 20191017

DOCDB simple family (application)

EP 19785252 A 20190405; CN 201980025207 A 20190405; JP 2018077903 A 20180413; JP 2019015135 W 20190405