EP 3785489 B1 20230802 - METHOD FOR PRINTING A STRUCTURED SILVER COATING WITH IMPROVED CURRENT CONDUCTIVITY
Title (en)
METHOD FOR PRINTING A STRUCTURED SILVER COATING WITH IMPROVED CURRENT CONDUCTIVITY
Title (de)
VERFAHREN ZUM DRUCKEN EINER STRUKTURIERTEN SILBERBESCHICHTUNG MIT VERBESSERTER STROMTRAGFÄHIGKEIT
Title (fr)
PROCÉDÉ D'IMPRESSION D'UN REVÊTEMENT EN ARGENT STRUCTURÉ À INTENSITÉ MAXIMALE ADMISSIBLE AMÉLIORÉE
Publication
Application
Priority
- EP 18169255 A 20180425
- EP 2019058490 W 20190404
Abstract (en)
[origin: WO2019206592A1] The invention relates to a method for producing a silver coating on a glass panel (16), wherein the silver coating comprises at least one bus bar (1) and/or at least one solder contact surface, wherein the method comprises the steps of printing the silver coating onto the glass panel (16) by means of screenprinting with a printing pattern having printing and non-printing regions, and baking the printed silver coating, wherein the (printing region 12) of the printing pattern for the bus bar and/or the printing region of the printing pattern for the solder contact surface is at least partly provided with a dot matrix (14) or a line matrix (20). By means of the method according to the invention, higher printing thicknesses of the bus bars and/or solder contact surfaces can be achieved as compared with conventional methods without the use of a dot matrix.
IPC 8 full level
H05B 3/84 (2006.01)
CPC (source: EP US)
B41M 1/12 (2013.01 - US); B41M 1/34 (2013.01 - US); B41M 3/006 (2013.01 - US); H05B 3/12 (2013.01 - US); H05B 3/84 (2013.01 - EP US); H05B 2203/011 (2013.01 - EP); H05B 2203/013 (2013.01 - US); H05B 2203/016 (2013.01 - US); H05B 2203/017 (2013.01 - EP US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated validation state (EPC)
MA
DOCDB simple family (publication)
WO 2019206592 A1 20191031; CN 110637503 A 20191231; CN 110637503 B 20221018; EP 3785489 A1 20210303; EP 3785489 B1 20230802; MA 52345 A 20210303; US 2021053376 A1 20210225
DOCDB simple family (application)
EP 2019058490 W 20190404; CN 201980001201 A 20190404; EP 19714224 A 20190404; MA 52345 A 20190404; US 201917050323 A 20190404