EP 3821208 B1 20240221 - APPARATUS, SYSTEMS, AND METHODS FOR NON-INVASIVE MEASUREMENT OF FLOW IN A HIGH TEMPERATURE PIPE
Title (en)
APPARATUS, SYSTEMS, AND METHODS FOR NON-INVASIVE MEASUREMENT OF FLOW IN A HIGH TEMPERATURE PIPE
Title (de)
VORRICHTUNG, SYSTEME UND VERFAHREN ZUR NICHTINVASIVEN MESSUNG DES DURCHFLUSSES IN EINEM HOCHTEMPERATURROHR
Title (fr)
APPAREIL, SYSTÈMES, ET PROCÉDÉS DE MESURE NON INVASIVE D'ÉCOULEMENT DANS UN TUYAU HAUTE TEMPÉRATURE
Publication
Application
Priority
- US 201862697101 P 20180712
- US 2019041359 W 20190711
Abstract (en)
[origin: US2020018628A1] A method, apparatus, and system according to which first and second transducers are connected to first and second waveguides, respectively, the first and second waveguides are connected to a pipe, and ultrasonic wave signals are exchanged between the first and second transducers, said ultrasonic wave signals passing through the first and second waveguides, the pipe, and a fluid in the pipe. A temperature of the fluid flowing in the pipe may exceed about 600° C. The first and second waveguides insulate the first and second transducers from the pipe and propagate the ultrasonic wave signals between the pipe and the first and second transducers, respectively, so that the ability of the first and second transducers to exchange the ultrasonic wave signals is not adversely affected by the temperature of the fluid in the pipe. The first and second waveguides may be made of a calcium silicate technical ceramic.
IPC 8 full level
G01F 1/66 (2022.01); G01D 5/02 (2006.01); G01F 1/667 (2022.01); G01F 1/72 (2006.01); G01M 3/24 (2006.01); G01P 5/24 (2006.01); G21C 17/022 (2006.01)
CPC (source: EP US)
C04B 28/18 (2013.01 - US); G01F 1/662 (2013.01 - EP US); G01F 1/667 (2013.01 - EP US); G01K 1/143 (2013.01 - US); G01P 5/245 (2013.01 - EP US); G01P 5/247 (2013.01 - EP); G21C 17/022 (2013.01 - EP US); G01N 2291/02836 (2013.01 - US); Y02E 30/30 (2013.01 - EP)
Citation (examination)
- US 5824915 A 19981020 - HUJZER ARIE [NL], et al
- CN 206378169 U 20170804 - SHANGHAI AUTOMATION INSTR CO LTD
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 10876871 B2 20201229; US 2020018628 A1 20200116; AU 2019302674 A1 20210304; AU 2019302674 B2 20230810; CA 3106690 A1 20200116; CN 112714862 A 20210427; EP 3821208 A1 20210519; EP 3821208 A4 20220330; EP 3821208 B1 20240221; EP 3821208 C0 20240221; ES 2972626 T3 20240613; JP 2021532377 A 20211125; US 11674832 B2 20230613; US 2021072057 A1 20210311; US 2023273058 A1 20230831; WO 2020014452 A1 20200116
DOCDB simple family (application)
US 201916508544 A 20190711; AU 2019302674 A 20190711; CA 3106690 A 20190711; CN 201980059613 A 20190711; EP 19834775 A 20190711; ES 19834775 T 20190711; JP 2021523568 A 20190711; US 2019041359 W 20190711; US 202016952192 A 20201119; US 202318312413 A 20230504