Global Patent Index - EP 3821298 A1

EP 3821298 A1 20210519 - METHOD FOR PATTERNING A SURFACE WITH A METAL BY CONTROLLING THE GENERATION OF CRACKS OR GAPS IN A DEPOSITED METAL LAYER

Title (en)

METHOD FOR PATTERNING A SURFACE WITH A METAL BY CONTROLLING THE GENERATION OF CRACKS OR GAPS IN A DEPOSITED METAL LAYER

Title (de)

VERFAHREN ZUR STRUKTURIERUNG EINER OBERFLÄCHE MIT EINEM METALL DURCH STEUERUNG DER ERZEUGUNG VON RISSEN ODER SPALTEN IN EINER ABGESCHIEDENEN METALLSCHICHT

Title (fr)

PROCÉDÉ DE FORMATION DE MOTIFS SUR UNE SURFACE EN UTILISANT UN MÉTAL ET EN CONTRÔLANT LA GÉNÉRATION DE FISSURES OU D'ESPACES DANS UNE COUCHE MÉTALLIQUE DÉPOSÉE

Publication

EP 3821298 A1 20210519 (EN)

Application

EP 19710175 A 20190222

Priority

  • SE 1850194 A 20180222
  • SE 2019050162 W 20190222

Abstract (en)

[origin: WO2019164443A1] The present invention relates to a method for patterning a surface with a metal by controlling the generation of cracks or gaps in a deposited metal layer, comprising the steps a) providing a substrate (101), optionally having at least one layer (102) provided thereon b) applying at least one layer of photoresist (104) on a surface (103) of the substrate (101) or of the at least one layer (102), c) baking the photoresist for removing excess solvent d) creating a pattern (110) in said photoresist to expose at least one portion of the surface (103), said pattern (110) comprising at least one edge (109) between the photoresist and the exposed at least one portion of the surface (103), e) depositing a metal on said photoresist and said at least one portion of the surface to form a metal layer (106), said metal having a temperature at deposition that is higher than a temperature of the substrate (101), f) cooling the deposited metal through contact with the exposed surface and the photoresist layer(104), thereby causing a contraction of the deposited metal and generating at least one crack or gap through the metal layer (106) at the edge (109), g) applying a solvent through the at least one crack or gap for removing the photoresist and thereby removing the metal layer (106) deposited thereon but leaving the metal deposited on the exposed surface (103).

IPC 8 full level

G03F 7/16 (2006.01); H01L 21/027 (2006.01); H01L 31/0224 (2006.01); H01L 31/18 (2006.01)

CPC (source: EP SE)

G03F 7/168 (2013.01 - SE); G03F 7/30 (2013.01 - SE); G03F 7/422 (2013.01 - SE); H01L 21/0272 (2013.01 - SE); H01L 31/022425 (2013.01 - EP); H01L 31/0463 (2014.12 - EP); H01L 31/18 (2013.01 - EP); H05K 3/064 (2013.01 - SE); Y02E 10/50 (2013.01 - EP); Y10S 438/951 (2013.01 - SE)

Citation (search report)

See references of WO 2019164443A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2019164443 A1 20190829; EP 3821298 A1 20210519; SE 1850194 A1 20190823; SE 541452 C2 20191008; WO 2019164444 A1 20190829; WO 2019164444 A8 20191114; WO 2019164444 A9 20200102

DOCDB simple family (application)

SE 2019050162 W 20190222; EP 19710175 A 20190222; SE 1850194 A 20180222; SE 2019050163 W 20190222