EP 3836308 A1 20210616 - CONNECTOR FOR HIGH-SPEED TRANSMISSION AND METHOD FOR FIXING SOLDER TO FORK PORTION OF CONNECTOR FOR HIGH-SPEED TRANSMISSION
Title (en)
CONNECTOR FOR HIGH-SPEED TRANSMISSION AND METHOD FOR FIXING SOLDER TO FORK PORTION OF CONNECTOR FOR HIGH-SPEED TRANSMISSION
Title (de)
VERBINDER FÜR HOCHGESCHWINDIGKEITSÜBERTRAGUNG UND VERFAHREN ZUR BEFESTIGUNG VON LÖTMITTEL AN EINEM GABELTEIL EINES VERBINDERS FÜR HOCHGESCHWINDIGKEITSÜBERTRAGUNG
Title (fr)
CONNECTEUR POUR TRANSMISSION À GRANDE VITESSE ET PROCÉDÉ DE FIXATION DE SOUDURE À LA PARTIE FOURCHE DU CONNECTEUR POUR TRANSMISSION À GRANDE VITESSE
Publication
Application
Priority
CN 201911264646 A 20191211
Abstract (en)
According to an embodiment of the present disclosure, a contact for high-speed transmission is provided. The contact (CNH, CNP) of the present embodiment includes a housing (1H, 1P) and a plurality of terminals (3H, 3P). The plurality of terminals (3H, 3P) have contact portions (37H, 37P) in contact with a counterpart connector (CNP, CNH) and soldering terminal portions soldered to a mounting target substrate (91, 90) in which the contact portions (37H, 37P) and the soldering terminal portions are arranged in the housing (1H, 1P) so as to face each other. The soldering terminal portion is a fork portion (30H, 30P), and a cut piece of a wire solder (300) is sandwiched and crimped in the fork portion (30H, 30P). The disclosed connector can reduce the overheating process of the terminal in the reflow and reduce the adverse effect on the finished product due to the heat treatment.
IPC 8 full level
H01R 12/70 (2011.01); H01R 12/58 (2011.01); H01R 13/24 (2006.01); H01R 43/02 (2006.01)
CPC (source: CN EP)
H01R 4/06 (2013.01 - CN); H01R 4/48185 (2023.08 - CN); H01R 12/57 (2013.01 - CN); H01R 12/58 (2013.01 - EP); H01R 12/707 (2013.01 - EP); H01R 12/716 (2013.01 - CN); H01R 13/02 (2013.01 - CN); H01R 13/2407 (2013.01 - EP); H01R 13/2464 (2013.01 - EP); H01R 13/46 (2013.01 - CN); H01R 13/6461 (2013.01 - CN); H01R 13/648 (2013.01 - CN); H01R 13/6585 (2013.01 - CN); H01R 43/0235 (2013.01 - EP); H01R 43/0256 (2013.01 - EP); H01R 43/048 (2013.01 - CN)
Citation (applicant)
JP 2018156936 A 20181004 - MOLEX LLC
Citation (search report)
- [XY] US 6969286 B1 20051129 - MONGOLD JOHN A [US], et al
- [X] CN 209329213 U 20190830 - PANYU DEYI PRECISE ELECTRONIC IND CO LTD
- [X] US 2012178298 A1 20120712 - JIN ZUO-FENG [CN]
- [X] US 8052436 B1 20111108 - JU TED [TW]
- [X] US 8192206 B1 20120605 - JU TED [TW]
- [Y] US 2004253852 A1 20041216 - REGNIER KENT E [US], et al
- [Y] US 2010330844 A1 20101230 - ITO TOSHIYASU [JP]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3836308 A1 20210616; CN 112952418 A 20210611; CN 112952418 B 20230411
DOCDB simple family (application)
EP 20213124 A 20201210; CN 202011306862 A 20201120