EP 3839092 A1 20210623 - METHOD FOR ACTIVATING AT LEAST ONE SURFACE, ACTIVATION COMPOSITION, AND USE OF THE ACTIVATION COMPOSITION TO ACTIVATE A SURFACE FOR ELECTROLESS PLATING
Title (en)
METHOD FOR ACTIVATING AT LEAST ONE SURFACE, ACTIVATION COMPOSITION, AND USE OF THE ACTIVATION COMPOSITION TO ACTIVATE A SURFACE FOR ELECTROLESS PLATING
Title (de)
VERFAHREN ZUR AKTIVIERUNG VON MINDESTENS EINER OBERFLÄCHE, AKTIVIERUNGSZUSAMMENSETZUNG UND VERWENDUNG DER AKTIVIERUNGSZUSAMMENSETZUNG ZUR AKTIVIERUNG EINER OBERFLÄCHE ZUR STROMLOSEN PLATTIERUNG
Title (fr)
PROCÉDÉ D'ACTIVATION D'AU MOINS UNE SURFACE, COMPOSITION D'ACTIVATION ET UTILISATION DE LA COMPOSITION D'ACTIVATION POUR ACTIVER UNE SURFACE DE DÉPÔT AUTOCATALYTIQUE
Publication
Application
Priority
EP 19219076 A 20191220
Abstract (en)
The present invention is directed to a method for activating at least one surface of a substrate, the method comprising the stepsa) providing the substrate having the at least one surface;b) optionally, pretreating the at least one surface of the substrate with a pretreating composition;c) optionally, conditioning the at least one surface of the substrate with a conditioning composition;d) contacting the at least one surface of the substrate with an activation composition comprisingi) copper ions; andii) at least one unsubstituted or substituted N-heteroaromatic compound;e) contacting the at least one surface of the substrate obtained after step d) with a reducing agent containing composition such that copper ions are reduced to metallic copper on said surfaceand thereby activating the at least one surface of the substrate.
IPC 8 full level
C23C 18/18 (2006.01); C23C 18/20 (2006.01)
CPC (source: EP)
C23C 18/1889 (2013.01); C23C 18/1893 (2013.01); C23C 18/206 (2013.01); C23C 18/208 (2013.01); C23C 18/2086 (2013.01)
Citation (applicant)
- US 2008038450 A1 20080214 - POOLE MARK A [US], et al
- WO 2013050332 A2 20130411 - ATOTECH DEUTSCHLAND GMBH [DE]
Citation (search report)
- [XYI] EP 3287465 A1 20180228 - LCY CHEMICAL CORP [TW]
- [Y] US 4248632 A 19810203 - EHRICH HANS J, et al
- [XI] EP 0381873 A2 19900816 - KEMIFAR SPA [IT]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DOCDB simple family (application)
EP 19219076 A 20191220