EP 3841849 B1 20240214 - MULTI-STACK COOLING STRUCTURE FOR RADIOFREQUENCY COMPONENT
Title (en)
MULTI-STACK COOLING STRUCTURE FOR RADIOFREQUENCY COMPONENT
Title (de)
MEHRSTAPEL-KÜHLSTRUKTUR FÜR HOCHFREQUENZKOMPONENTE
Title (fr)
STRUCTURE DE REFROIDISSEMENT À EMPILEMENT MULTIPLE POUR COMPOSANT RADIOFRÉQUENCE
Publication
Application
Priority
US 2018047091 W 20180820
Abstract (en)
[origin: WO2020040725A1] An apparatus (100) includes: a circuit board (102) having a radiofrequency (RF) structure (108, 114) at a first location thereof, the RF structure formed from a conductive trace of the circuit board; a heat carrier (118); and a multi-stack cooling structure (116) coupling the circuit board (102) and the heat carrier (118) to each other, the multi-stack cooling structure (116) including a first stack (120) adjacent the RF structure at the first location and a second stack (122, 132) at a second location, the first stack (120) including a dielectric layer (126) adjacent the heat carrier (118), and a thermal interface material (TIM) (124) that couples the dielectric layer (126) and the circuit board (102) to each other, the dielectric layer (126) having higher thermal conductivity and higher rigidity than the TIM (124), the second stack (122, 132) including a metal layer (134) adjacent the heat carrier (118), and the TIM (136) that couples the metal layer (134) and the circuit board (102) to each other.
IPC 8 full level
H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP KR US)
H05K 1/0204 (2013.01 - EP KR US); H05K 1/021 (2013.01 - EP KR US); H05K 1/0239 (2013.01 - EP KR US); H05K 1/165 (2013.01 - EP KR US); H05K 3/0061 (2013.01 - EP KR); H05K 3/0067 (2013.01 - EP KR); H05K 2201/086 (2013.01 - EP KR); H05K 2201/09972 (2013.01 - EP KR); H05K 2201/10416 (2013.01 - EP KR US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2020040725 A1 20200227; CN 112586090 A 20210330; CN 112586090 B 20240604; EP 3841849 A1 20210630; EP 3841849 B1 20240214; JP 2021534588 A 20211209; JP 7116843 B2 20220810; KR 102564297 B1 20230804; KR 20210042902 A 20210420; TW 202010373 A 20200301; TW I738019 B 20210901; US 11382206 B2 20220705; US 2021259092 A1 20210819
DOCDB simple family (application)
US 2018047091 W 20180820; CN 201880096734 A 20180820; EP 18773889 A 20180820; JP 2021507997 A 20180820; KR 20217002960 A 20180820; TW 108122755 A 20190628; US 201817269461 A 20180820