EP 3850924 A1 20210721 - METHOD FOR PRODUCING A CIRCUIT BOARD ASSEMBLY, AND CIRCUIT BOARD ASSEMBLY
Title (en)
METHOD FOR PRODUCING A CIRCUIT BOARD ASSEMBLY, AND CIRCUIT BOARD ASSEMBLY
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTENANORDNUNG UND LEITERPLATTENANORDNUNG
Title (fr)
PROCÉDÉ DE FABRICATION D'UN ENSEMBLE CARTE DE CIRCUIT IMPRIMÉ ET ENSEMBLE CARTE DE CIRCUIT IMPRIMÉ
Publication
Application
Priority
- DE 102018215672 A 20180914
- EP 2019074014 W 20190910
Abstract (en)
[origin: WO2020053160A1] The invention relates to a method for producing a circuit board assembly (3), comprising the steps: providing a first circuit board substrate (1); providing a second circuit board substrate (2), which is arranged substantially plane-parallel to the first circuit board substrate (1), the first circuit board substrate (1) having a bottom side (11) and the second circuit board substrate (2) having a surface (12), the surface (12) and the bottom side (11) being arranged facing one another; providing first connection contacts (14), which are applied to the bottom side (11) of the first circuit board substrate (1); providing second connection contacts, which are applied to the surface (12) of the second circuit board substrate (2); applying solder paste cylinders (7) to the first connection contacts (14), the solder paste cylinders (7) being applied to the first connection contacts (14) by means of a solder paste application method with solder paste, the applied solder paste cylinders (7) each having a solder paste cylinder surface; and arranging the second connection contacts (4) of the second circuit board substrate (2) on the solder paste cylinder surfaces of the solder paste cylinders (7). The invention further relates to a circuit board assembly.
IPC 8 full level
H05K 3/34 (2006.01); H05K 1/02 (2006.01); H05K 3/12 (2006.01)
CPC (source: EP US)
H05K 3/1216 (2013.01 - US); H05K 3/3485 (2020.08 - EP US); H05K 3/363 (2013.01 - US); H05K 1/0271 (2013.01 - EP); H05K 3/1216 (2013.01 - EP); H05K 3/1225 (2013.01 - EP); H05K 2201/068 (2013.01 - EP); H05K 2201/09063 (2013.01 - EP); H05K 2201/09136 (2013.01 - EP US); H05K 2201/09736 (2013.01 - EP); H05K 2201/10628 (2013.01 - US); H05K 2201/10719 (2013.01 - EP); H05K 2201/10734 (2013.01 - US); H05K 2203/0415 (2013.01 - EP)
Citation (search report)
See references of WO 2020053160A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2020053160 A1 20200319; CN 112703825 A 20210423; DE 102018215672 A1 20200319; EP 3850924 A1 20210721; US 2021329793 A1 20211021
DOCDB simple family (application)
EP 2019074014 W 20190910; CN 201980059480 A 20190910; DE 102018215672 A 20180914; EP 19768755 A 20190910; US 201917273133 A 20190910