EP 3853936 A1 20210728 - COMPOSITIONS FOR BIPOLAR PLATES AND METHODS FOR MANUFACTURING SAID COMPOSITIONS
Title (en)
COMPOSITIONS FOR BIPOLAR PLATES AND METHODS FOR MANUFACTURING SAID COMPOSITIONS
Title (de)
ZUSAMMENSETZUNGEN FÜR BIPOLARE PLATTEN UND VERFAHREN ZUR HERSTELLUNG DER BESAGTEN ZUSAMMENSETZUNGEN
Title (fr)
COMPOSITIONS POUR PLAQUES BIPOLAIRES ET METHODES DE FABRICATION DE CES COMPOSITIONS
Publication
Application
Priority
- FR 1858598 A 20180921
- FR 2019052175 W 20190918
Abstract (en)
[origin: WO2020058627A1] The present invention relates to new compositions for bipolar plates and to methods for manufacturing said compositions. More specifically, the invention relates to a method for manufacturing a composition, comprising the following steps: mixing a thermoplastic polymer in the molten state with a first conductive charge in order to obtain a conductive thermoplastic polymer; grinding said conductive thermoplastic polymer in order to reduce it to a powder; mixing the conductive thermoplastic polymer powder with a second conductive charge.
IPC 8 full level
H01M 8/0226 (2016.01); H01M 8/18 (2006.01)
CPC (source: EP KR US)
B29B 9/02 (2013.01 - US); B29B 9/12 (2013.01 - US); B29C 43/003 (2013.01 - US); B29C 45/0001 (2013.01 - US); H01M 8/0213 (2013.01 - KR); H01M 8/0221 (2013.01 - KR); H01M 8/0226 (2013.01 - EP KR); B29C 45/0013 (2013.01 - US); B29K 2023/06 (2013.01 - US); B29K 2023/12 (2013.01 - US); B29K 2081/04 (2013.01 - US); B29K 2507/04 (2013.01 - US); B29K 2509/00 (2013.01 - US); B29K 2995/0005 (2013.01 - US); H01M 8/0226 (2013.01 - US); H01M 8/188 (2013.01 - EP KR); H01M 50/406 (2021.01 - US); H01M 50/446 (2021.01 - US); Y02E 60/10 (2013.01 - EP); Y02E 60/50 (2013.01 - EP); Y02P 70/50 (2015.11 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2020058627 A1 20200326; CN 112655104 A 20210413; EP 3853936 A1 20210728; FR 3086292 A1 20200327; FR 3086292 B1 20210507; JP 2022501464 A 20220106; JP 7460610 B2 20240402; KR 20210060499 A 20210526; US 2021354332 A1 20211118
DOCDB simple family (application)
FR 2019052175 W 20190918; CN 201980058920 A 20190918; EP 19790668 A 20190918; FR 1858598 A 20180921; JP 2021514500 A 20190918; KR 20217009723 A 20190918; US 201917277371 A 20190918