EP 3854755 A1 20210728 - SURFACE TREATED-METAL OXIDE PARTICLE MATERIAL, METHOD FOR PRODUCING SAME, RESIN COMPOSITION FOR ELECTRONIC MATERIAL, AND FILLER FOR SILICONE RESIN MATERIAL
Title (en)
SURFACE TREATED-METAL OXIDE PARTICLE MATERIAL, METHOD FOR PRODUCING SAME, RESIN COMPOSITION FOR ELECTRONIC MATERIAL, AND FILLER FOR SILICONE RESIN MATERIAL
Title (de)
MATERIAL AUS OBERFLÄCHENBEHANDELTEN METALLOXIDTEILCHEN, VERFAHREN ZUR HERSTELLUNG DAVON, HARZZUSAMMENSETZUNG FÜR ELEKTRONISCHES MATERIAL UND FÜLLSTOFF FÜR SILIKONHARZMATERIAL
Title (fr)
MATÉRIAU PARTICULAIRE D'OXYDE MÉTALLIQUE TRAITÉ EN SURFACE, SON PROCÉDÉ DE PRODUCTION, COMPOSITION DE RÉSINE POUR UN MATÉRIAU ÉLECTRONIQUE, ET CHARGE POUR UN MATÉRIAU EN RÉSINE DE SILICONE
Publication
Application
Priority
- JP 2018200341 A 20181024
- JP 2019040921 W 20191017
Abstract (en)
Provided is a filler that has a low viscosity when mixed in a resin material and has reduced permittivity and dielectric loss tangent.The filler includes: a metal oxide particle material; and a polyorganosiloxane compound with which a surface treatment is performed on the metal oxide particle material and which is represented by general formula (1): (RO)<sub>3</sub>Si-(SiR<sub>2</sub>-O-)<sub>n</sub>-SiR<sub>3</sub> (in general formula (1), each R is independently selected from among alkyl groups having 1 to 4 carbon atoms, and n is not less than 10 and not greater than 200). A resin composition obtained by containing the filler in a resin is suitable for an electronic material.
IPC 8 full level
C01F 7/02 (2006.01); C08K 3/22 (2006.01); C08K 9/06 (2006.01); C08L 83/04 (2006.01); C09C 1/00 (2006.01); C09C 3/12 (2006.01)
CPC (source: EP KR US)
C01F 7/026 (2013.01 - KR); C08G 77/18 (2013.01 - EP); C08K 3/013 (2018.01 - US); C08K 3/22 (2013.01 - KR US); C08K 9/06 (2013.01 - KR); C08K 9/08 (2013.01 - EP); C08L 83/04 (2013.01 - KR); C08L 83/06 (2013.01 - US); C09C 1/00 (2013.01 - KR); C09C 1/028 (2013.01 - EP); C09C 1/043 (2013.01 - EP); C09C 1/24 (2013.01 - EP); C09C 1/3081 (2013.01 - EP); C09C 1/3684 (2013.01 - EP); C09C 1/407 (2013.01 - EP); C09C 3/12 (2013.01 - EP KR); C09D 183/04 (2013.01 - EP); C01P 2004/61 (2013.01 - EP); C01P 2004/62 (2013.01 - EP); C01P 2006/12 (2013.01 - EP); C01P 2006/22 (2013.01 - EP); C01P 2006/40 (2013.01 - EP); C01P 2006/42 (2013.01 - EP); C08K 2003/2227 (2013.01 - EP US); C08K 2201/003 (2013.01 - EP)
C-Set (source: EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3854755 A1 20210728; EP 3854755 A4 20211208; EP 3854755 B1 20240110; EP 3854755 C0 20240110; CN 112399962 A 20210223; CN 112399962 B 20210910; JP 2020066678 A 20200430; JP 6603777 B1 20191106; KR 102268485 B1 20210622; KR 20200140918 A 20201216; TW 202023950 A 20200701; TW I697457 B 20200701; US 11401423 B2 20220802; US 2021238421 A1 20210805; WO 2020085198 A1 20200430
DOCDB simple family (application)
EP 19876447 A 20191017; CN 201980046812 A 20191017; JP 2018200341 A 20181024; JP 2019040921 W 20191017; KR 20207034319 A 20191017; TW 108138272 A 20191023; US 202117237294 A 20210422