Title (en)

METHOD AND APPARATUS FOR MONITORING A PROCESSING PROCESS OF A WORKPIECE BY MEANS OF A LASER BEAM

Title (de)

VERFAHREN UND VORRICHTUNG ZUR ÜBERWACHUNG EINES BEARBEITUNGSPROZESSES EINES WERKSTÜCKS MITTELS EINES LASERSTRAHLS

Title (fr)

PROCÉDÉ ET DISPOSITIF DE SURVEILLANCE D'UN PROCESSUS D'USINAGE D'UNE PIÈCE AU MOYEN D'UN FAISCEAU LASER

Publication

EP 3860796 A1 20210811 (DE)

Application

EP 19773010 A 20190916

Priority

• DE 102018124208 A 20181001
• EP 2019074618 W 20190916

Abstract (en)

[origin: WO2020069840A1] The invention relates to an apparatus for monitoring a laser processing process on a workpiece, comprising: a computing unit (16), which is configured to determine a dynamic processing position (TCPi) relative to a point of incidence (AP) of the laser beam (1) for a process parameter set (PPS) of the laser processing process by means of a model based on at least one stipulated comparison parameter set and an associated comparison processing position, and an observation unit (17), which is configured to determine at least one monitoring parameter of the laser processing process at the dynamic processing position (TCPi).

IPC 8 full level

B23K 26/02 (2014.01); B23K 26/03 (2006.01); B23K 31/12 (2006.01)

CPC (source: EP)

B23K 26/02 (2013.01); B23K 26/032 (2013.01); B23K 31/125 (2013.01); G01B 11/22 (2013.01)

Citation (search report)

See references of WO 2020069840A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

DE 102018124208 A1 20200402; DE 102018124208 B4 20210812; CN 112912197 A 20210604; CN 112912197 B 20230606; EP 3860796 A1 20210811; JP 2022504092 A 20220113; JP 7241171 B2 20230316; JP 7241171 B6 20240213; WO 2020069840 A1 20200409

DOCDB simple family (application)

DE 102018124208 A 20181001; CN 201980065194 A 20190916; EP 19773010 A 20190916; EP 2019074618 W 20190916; JP 2021518118 A 20190916