EP 3868924 A1 20210825 - METHOD FOR SUPPRESSING INCREASE IN ZINC CONCENTRATION IN PLATING SOLUTION, AND METHOD FOR PRODUCING ZINC-BASED PLATING MEMBER
Title (en)
METHOD FOR SUPPRESSING INCREASE IN ZINC CONCENTRATION IN PLATING SOLUTION, AND METHOD FOR PRODUCING ZINC-BASED PLATING MEMBER
Title (de)
VERFAHREN ZUR UNTERDRÜCKUNG DER ERHÖHUNG DER ZINKKONZENTRATION IN EINER PLATTIERUNGSLÖSUNG UND VERFAHREN ZUR HERSTELLUNG EINER BESCHICHTUNG AUF ZINKBASIS
Title (fr)
PROCÉDÉ DE SUPPRESSION D'AUGMENTATION DE LA CONCENTRATION EN ZINC DANS UNE SOLUTION DE PLACAGE, ET PROCÉDÉ DE PRODUCTION D'ÉLÉMENT DE PLACAGE À BASE DE ZINC
Publication
Application
Priority
- JP 2019214897 A 20191128
- JP 2020031629 W 20200821
Abstract (en)
Provided is a method for suppressing an increase in the zinc concentration of a plating solution when a zinc alloy plating member using nickel as an alloy element is manufactured using a zinc alloy plating apparatus. The plating apparatus includes: a plating tank capable of accommodating the plating solution which is acidic; a first diaphragm tank which is capable of accommodating a first electrolytic solution and has a first diaphragm composed of a cation exchange membrane; a cathode holding member for cathode-electrolyzing a member to be plated that is in contact with the plating solution inside the plating tank during use; a first anode holding member for anode-electrolyzing a soluble zinc-containing member that is in contact with the first electrolytic solution inside the first diaphragm tank during use; the soluble zinc-containing member held by the first anode holding member; a soluble metal-containing member containing the nickel which is the alloy element; and a second anode holding member for anode-electrolyzing the soluble metal-containing member. The first diaphragm tank is arranged in a manner that the first electrolytic solution is in contact with one surface of the first diaphragm and the plating solution is in contact with the other surface of the first diaphragm during use.
IPC 8 full level
C25D 3/56 (2006.01); C25D 17/00 (2006.01); C25D 17/10 (2006.01); C25D 17/12 (2006.01)
CPC (source: CN EP US)
C25D 3/562 (2013.01 - EP); C25D 3/565 (2013.01 - CN EP US); C25D 17/00 (2013.01 - CN); C25D 17/002 (2013.01 - CN EP US); C25D 17/10 (2013.01 - EP); C25D 21/06 (2013.01 - CN); C25D 21/10 (2013.01 - CN); C25D 21/14 (2013.01 - EP US); C25D 21/18 (2013.01 - CN); C25D 17/06 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3868924 A1 20210825; EP 3868924 A4 20220309; CN 113195798 A 20210730; JP 2021085068 A 20210603; JP 6750186 B1 20200902; MX 2021007195 A 20220318; US 2022298668 A1 20220922; WO 2021106291 A1 20210603
DOCDB simple family (application)
EP 20886179 A 20200821; CN 202080006376 A 20200821; JP 2019214897 A 20191128; JP 2020031629 W 20200821; MX 2021007195 A 20200821; US 202017297470 A 20200821