EP 3869541 A2 20210825 - INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS ELECTRICALLY COUPLED THROUGH A SYNCHRONIZATION SIGNAL
Title (en)
INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS ELECTRICALLY COUPLED THROUGH A SYNCHRONIZATION SIGNAL
Title (de)
INTEGRIERTE SCHALTUNG UND ELEKTRONISCHE VORRICHTUNG MIT MEHREREN INTEGRIERTEN SCHALTUNGEN, DIE DURCH EIN SYNCHRONISATIONSSIGNAL ELEKTRISCH GEKOPPELT SIND
Title (fr)
CIRCUIT INTÉGRÉ ET DISPOSITIF ÉLECTRONIQUE COMPRENANT UNE PLURALITÉ DE CIRCUITS INTÉGRÉS COUPLÉS ÉLECTRIQUEMENT PAR UN SIGNAL DE SYNCHRONISATION
Publication
Application
Priority
IT 202000001819 A 20200130
Abstract (en)
The electronic device has a plurality of integrated circuits fixed to a support between transmitting and receiving antennas. An integrated circuit generates a synchronization signal supplied to the other integrated circuits. Each integrated circuit is formed in a die (57) integrating electronic components (58) and overlaid by a connection region (59) according to the Flip-Chip Ball-Grid-array (FC-BGA) or embedded Wafer Level BGA (eWLB). A plurality of solder balls (65) for each integrated circuit is electrically coupled to the electronic components (58) and bonded between the respective integrated circuit and the support (52). The solder balls (65) are arranged in an array, aligned along a plurality of lines parallel to a direction, wherein the plurality of lines comprises an empty line along which no solder balls are present. A conductive synchronization path (66) is formed on the support (52) and extends along the empty line of at least one integrated circuit (53), between the solder balls (65) of the latter.
IPC 8 full level
H01L 21/60 (2006.01); H01L 23/66 (2006.01)
CPC (source: CN EP US)
H01L 23/488 (2013.01 - CN); H01L 23/49816 (2013.01 - CN); H01L 23/49838 (2013.01 - CN); H01L 23/5386 (2013.01 - US); H01L 23/66 (2013.01 - CN EP US); H01L 24/14 (2013.01 - EP US); H01L 24/16 (2013.01 - US); H01L 24/17 (2013.01 - US); H01L 24/20 (2013.01 - EP); H01L 24/48 (2013.01 - US); H01L 24/73 (2013.01 - US); H01L 25/0655 (2013.01 - CN US); H01L 25/105 (2013.01 - US); H01L 24/13 (2013.01 - EP); H01L 24/16 (2013.01 - EP); H01L 24/32 (2013.01 - EP); H01L 24/48 (2013.01 - EP); H01L 24/73 (2013.01 - EP); H01L 24/92 (2013.01 - EP); H01L 2223/6627 (2013.01 - EP US); H01L 2223/6677 (2013.01 - CN EP US); H01L 2223/6683 (2013.01 - CN EP US); H01L 2224/04042 (2013.01 - EP); H01L 2224/04105 (2013.01 - EP); H01L 2224/05567 (2013.01 - EP); H01L 2224/12105 (2013.01 - EP); H01L 2224/131 (2013.01 - EP); H01L 2224/14133 (2013.01 - US); H01L 2224/1416 (2013.01 - EP); H01L 2224/14164 (2013.01 - EP); H01L 2224/16225 (2013.01 - US); H01L 2224/16227 (2013.01 - EP); H01L 2224/17133 (2013.01 - US); H01L 2224/32225 (2013.01 - EP); H01L 2224/48091 (2013.01 - EP); H01L 2224/48105 (2013.01 - US); H01L 2224/48225 (2013.01 - US); H01L 2224/48227 (2013.01 - EP); H01L 2224/73204 (2013.01 - EP); H01L 2224/73253 (2013.01 - EP); H01L 2224/73257 (2013.01 - US); H01L 2224/92125 (2013.01 - EP); H01L 2924/1423 (2013.01 - EP US); H01L 2924/15192 (2013.01 - EP); H01L 2924/15311 (2013.01 - EP); H01L 2924/16251 (2013.01 - EP); H01L 2924/18162 (2013.01 - EP); H01L 2924/1903 (2013.01 - EP); H01L 2924/19032 (2013.01 - EP); H01L 2924/19033 (2013.01 - EP)
C-Set (source: EP)
Citation (applicant)
US 8949606 B2 20150203 - SCHACHTNER SVEN [DE], et al
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3869541 A2 20210825; EP 3869541 A3 20211208; CN 113206069 A 20210803; CN 215600361 U 20220121; IT 202000001819 A1 20210730; US 11742311 B2 20230829; US 2021242157 A1 20210805; US 2023335524 A1 20231019
DOCDB simple family (application)
EP 21153537 A 20210126; CN 202110139579 A 20210201; CN 202120282004 U 20210201; IT 202000001819 A 20200130; US 202117162595 A 20210129; US 202318334280 A 20230613