EP 3871252 A1 20210901 - PROTECTION OF WIRE-BOND BALL GRID ARRAY PACKAGED INTEGRATED CIRCUIT CHIPS
Title (en)
PROTECTION OF WIRE-BOND BALL GRID ARRAY PACKAGED INTEGRATED CIRCUIT CHIPS
Title (de)
SCHUTZ VON INTEGRIERTEN SCHALTUNGSCHIPS, DIE IN EINER DRAHTGEBUNDENEN KUGELGITTERANORDNUNG GEPACKT SIND
Title (fr)
PROTECTION DE PUCES DE CIRCUIT INTÉGRÉ ENCAPSULÉES DANS UN BOÎTIER MATRICIEL À BILLES À LIAISON FILAIRE
Publication
Application
Priority
- EP 18202853 A 20181026
- EP 2019078247 W 20191017
Abstract (en)
[origin: EP3644351A1] The present application is directed at protecting integrated circuits which are packaged in a wire-bond ball grid array form of package and in particular is directed at preventing an attack through the substrate of the package directly underneath the integrated circuit.
IPC 8 full level
H01L 23/00 (2006.01); H01L 21/02 (2006.01); H01L 23/488 (2006.01); H01L 23/58 (2006.01)
CPC (source: EP KR US)
H01L 22/14 (2013.01 - US); H01L 23/49816 (2013.01 - US); H01L 23/5386 (2013.01 - US); H01L 23/552 (2013.01 - US); H01L 23/573 (2013.01 - EP KR); H01L 23/576 (2013.01 - EP KR); H01L 23/585 (2013.01 - EP KR); H01L 24/14 (2013.01 - US); H01L 24/16 (2013.01 - KR); H01L 24/29 (2013.01 - KR); H01L 24/32 (2013.01 - KR); H01L 24/48 (2013.01 - KR); H01L 24/73 (2013.01 - KR); H01L 24/16 (2013.01 - EP); H01L 24/29 (2013.01 - EP); H01L 24/32 (2013.01 - EP); H01L 24/48 (2013.01 - EP); H01L 24/73 (2013.01 - EP); H01L 2224/0401 (2013.01 - US); H01L 2224/16227 (2013.01 - EP KR); H01L 2224/2919 (2013.01 - EP KR); H01L 2224/32225 (2013.01 - EP KR); H01L 2224/32245 (2013.01 - EP KR); H01L 2224/48091 (2013.01 - EP KR); H01L 2224/48227 (2013.01 - EP KR); H01L 2224/73265 (2013.01 - EP KR); H01L 2924/14 (2013.01 - US); H01L 2924/15182 (2013.01 - EP KR); H01L 2924/15311 (2013.01 - EP KR); H01L 2924/3011 (2013.01 - EP KR); H01L 2924/3025 (2013.01 - EP KR)
C-Set (source: EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3644351 A1 20200429; CN 112913004 A 20210604; EP 3871252 A1 20210901; JP 2022505555 A 20220114; JP 7407811 B2 20240104; KR 20210083272 A 20210706; SG 11202102932S A 20210429; US 2021358837 A1 20211118; WO 2020083745 A1 20200430
DOCDB simple family (application)
EP 18202853 A 20181026; CN 201980069250 A 20191017; EP 19786606 A 20191017; EP 2019078247 W 20191017; JP 2021521841 A 20191017; KR 20217012834 A 20191017; SG 11202102932S A 20191017; US 201917286709 A 20191017