EP 3879345 B1 20230809 - METHODS OF DETERMINING CORRECTIONS FOR A PATTERNING PROCESS
Title (en)
METHODS OF DETERMINING CORRECTIONS FOR A PATTERNING PROCESS
Title (de)
VERFAHREN FÜR BESTIMMTE KORREKTUREN FÜR EIN STRUKTURIERUNGSVERFAHREN
Title (fr)
PROCÉDÉS DE CORRECTIONS DÉTERMINÉES POUR UN PROCESSUS DE FORMATION DE MOTIF
Publication
Application
Priority
- EP 16195047 A 20161021
- EP 17150658 A 20170109
- EP 17154129 A 20170201
- EP 17187411 A 20170823
- EP 17781433 A 20170928
- EP 2017074643 W 20170928
Abstract (en)
[origin: WO2018072980A1] Disclosed is a method of determining a correction for a process parameter related to a lithographic process on a substrate and associated apparatuses. The lithographic process comprises a plurality of runs during each one of which a pattern is applied to one or more substrates. The method comprises obtaining pre-exposure metrology data describing a property of the substrate; obtaining post- exposure metrology data comprising one or more measurements of the process parameter having been performed on one or more previously exposed substrates; assigning to the substrate, a group membership status from a one or more groups, based on said pre-exposure metrology data; and determining the correction for the process parameter based on said group membership status and said post-exposure metrology data.
IPC 8 full level
G03F 7/20 (2006.01)
CPC (source: CN EP KR US)
G03F 7/705 (2013.01 - CN US); G03F 7/70508 (2013.01 - CN EP KR US); G03F 7/70525 (2013.01 - CN EP KR); G03F 7/70616 (2013.01 - CN EP KR); G03F 7/70633 (2013.01 - CN US); G05B 19/18 (2013.01 - CN KR); G05B 19/41875 (2013.01 - CN KR)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2018072980 A1 20180426; CN 109863456 A 20190607; CN 109863456 B 20210618; CN 113406865 A 20210917; CN 113406865 B 20240227; EP 3529667 A1 20190828; EP 3529667 B1 20210519; EP 3879345 A1 20210915; EP 3879345 B1 20230809; JP 2019531506 A 20191031; JP 6884855 B2 20210609; KR 102334937 B1 20211203; KR 102450492 B1 20220930; KR 102555175 B1 20230712; KR 20190053269 A 20190517; KR 20210037009 A 20210405; KR 20210151237 A 20211213; KR 20220136503 A 20221007; TW 201830154 A 20180816; TW 201921167 A 20190601; TW 202022860 A 20200616; TW 202136929 A 20211001; TW I649641 B 20190201; TW I685724 B 20200221; TW I731581 B 20210621; TW I817134 B 20231001; US 10877381 B2 20201229; US 11327407 B2 20220510; US 11592753 B2 20230228; US 11782349 B2 20231010; US 2020019067 A1 20200116; US 2021080836 A1 20210318; US 2022229373 A1 20220721; US 2023168591 A1 20230601
DOCDB simple family (application)
EP 2017074643 W 20170928; CN 201780065318 A 20170928; CN 202110757769 A 20170928; EP 17781433 A 20170928; EP 21167888 A 20170928; JP 2019515497 A 20170928; KR 20197012224 A 20170928; KR 20217009080 A 20170928; KR 20217039186 A 20170928; KR 20227033727 A 20170928; TW 106135524 A 20171017; TW 108100498 A 20171017; TW 109104361 A 20171017; TW 110120349 A 20171017; US 201716335277 A 20170928; US 202017102850 A 20201124; US 202217715112 A 20220407; US 202318100662 A 20230124