EP 3884519 A1 20210929 - DISSIPATING HEAT FROM AN ELECTRONIC ASSEMBLY USING FORCED CONVECTION, AND METHOD FOR DISSIPATING HEAT FROM AN ELECTRONIC ASSEMBLY
Title (en)
DISSIPATING HEAT FROM AN ELECTRONIC ASSEMBLY USING FORCED CONVECTION, AND METHOD FOR DISSIPATING HEAT FROM AN ELECTRONIC ASSEMBLY
Title (de)
ENTWÄRMUNG EINER ELEKTRONISCHEN BAUGRUPPE MITTELS FORCIERTER KONVEKTION, SOWIE VERFAHREN ZUM ENTWÄRMEN EINER ELEKTRONISCHEN BAUGRUPPE
Title (fr)
DISSIPATION DE LA CHALEUR D'UN BLOC ÉLECTRONIQUE PAR CONVECTION FORCÉE, ET PROCÉDÉ POUR DISSIPER LA CHALEUR D'UN BLOC ÉLECTRONIQUE
Publication
Application
Priority
- EP 19155237 A 20190204
- EP 2020052168 W 20200129
Abstract (en)
[origin: WO2020160978A1] The invention relates to an electronic assembly (1) comprising: - a printed circuit board (2) which is designed with a first populating side (3) and a second populating side (4), - at least one first heat sink (5) which is arranged on the first populating side (3), - multiple electronic components (6), a plurality of which are arranged on the second populating side (4) of the printed circuit board (2), - at least one first non-current-conducting via (7) in the printed circuit board (2), said via being used to transport the thermal energy generated by an electronic component (6) from the second populating side (4) to the first populating side (3), and - a convection unit (8) for generating a forced convection (9) solely on the first populating side (3), wherein the thermal energy can be transported away from the printed circuit board (2) of the electronic assembly (1) by means of the forced convection so that heat can be dissipated from the electronic assembly (1). The invention additionally relates to a method for dissipating heat from an electronic assembly (1).
IPC 8 full level
H01L 23/367 (2006.01); H01L 23/467 (2006.01); H05K 1/02 (2006.01)
CPC (source: EP US)
H01L 23/3677 (2013.01 - EP); H01L 23/467 (2013.01 - EP); H05K 1/0206 (2013.01 - US); H05K 1/181 (2013.01 - US)
Citation (search report)
See references of WO 2020160978A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3690934 A1 20200805; CN 113383414 A 20210910; EP 3884519 A1 20210929; US 11337299 B2 20220517; US 2022046786 A1 20220210; WO 2020160978 A1 20200813
DOCDB simple family (application)
EP 19155237 A 20190204; CN 202080012256 A 20200129; EP 2020052168 W 20200129; EP 20704425 A 20200129; US 202017428202 A 20200129