EP 3885111 A4 20220126 - COMPOSITE MATERIAL MOLDING METHOD
Title (en)
COMPOSITE MATERIAL MOLDING METHOD
Title (de)
VERFAHREN ZUM FORMEN EINES VERBUNDWERKSTOFFES
Title (fr)
PROCÉDÉ DE MOULAGE DE MATÉRIAU COMPOSITE
Publication
Application
Priority
- JP 2020001292 W 20200116
- JP 2019013582 A 20190129
Abstract (en)
[origin: EP3885111A1] A composite material forming method that reduces the occurrence of temperature unevenness in a composite material during heating is provided. The composite material forming method is a method for forming a composite material 10 including reinforcing fibers 12, and includes an equipotential-material connecting step and a magnetic-field applying step. The equipotential-material connecting step is a step of connecting end portions of the reinforcing fibers 12 with equipotential materials 16 to form an electroconductive loop including the reinforcing fibers 12 in the composite material 10 before reaction. The magnetic-field applying step is a step of applying a magnetic field 42 in a direction intersecting a plane formed by the electroconductive loop.
IPC 8 full level
B29C 70/20 (2006.01); B29C 70/40 (2006.01); B29C 70/88 (2006.01)
CPC (source: EP US)
B29C 35/0272 (2013.01 - EP); B29C 35/0805 (2013.01 - EP US); B29C 70/20 (2013.01 - US); B29C 70/46 (2013.01 - EP); B29C 70/54 (2013.01 - US); B29C 70/882 (2013.01 - EP); B29C 2035/0811 (2013.01 - US); B29C 2035/0816 (2013.01 - EP US)
Citation (search report)
- [XAI] US 2372929 A 19450403 - BLESSING GREGORY W
- [X] US 2003062118 A1 20030403 - GERHARD JACK K [US], et al
- [A] US 5357085 A 19941018 - STURMAN JR PHILIP C [US]
- [A] JP S5942928 A 19840309 - MITSUBISHI RAYON CO
- [A] EP 2821200 A1 20150107 - DEUTSCHES ZENTRUM FUER LUFT & RAUMFAHRT EV [DE]
- See references of WO 2020158416A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3885111 A1 20210929; EP 3885111 A4 20220126; EP 3885111 B1 20240221; JP 2020121441 A 20200813; JP 7217457 B2 20230203; US 11987013 B2 20240521; US 2022080682 A1 20220317; WO 2020158416 A1 20200806
DOCDB simple family (application)
EP 20749433 A 20200116; JP 2019013582 A 20190129; JP 2020001292 W 20200116; US 202017419793 A 20200116