Global Patent Index - EP 3885474 A1

EP 3885474 A1 20210929 - METHOD FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE IN A PROCESS STATION

Title (en)

METHOD FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE IN A PROCESS STATION

Title (de)

VERFAHREN ZUR CHEMISCHEN UND/ODER ELEKTROLYTISCHEN OBERFLÄCHENBEHANDLUNG EINES SUBSTRATS IN EINER PROZESSSTATION

Title (fr)

PROCÉDÉ POUR UN TRAITEMENT DE SURFACE CHIMIQUE ET/OU ÉLECTROLYTIQUE D'UN SUBSTRAT DANS UNE STATION DE TRAITEMENT

Publication

EP 3885474 A1 20210929 (EN)

Application

EP 20165608 A 20200325

Priority

EP 20165608 A 20200325

Abstract (en)

The invention relates to a method for a chemical and/or electrolytic surface treatment of a substrate in a process station and a process station for a chemical and/or electrolytic surface treatment of a substrate.The method for a chemical and/or electrolytic surface treatment comprises the following steps, not necessarily in this order:- mounting a substrate to be treated to a rotor unit,- moving the rotor unit with the substrate into a pre-wetting chamber of the process station,- applying a pre-wetting fluid to the substrate in the pre-wetting chamber,- moving the rotor unit with the substrate at least partially out of the pre-wetting chamber,- spinning the rotor unit with the substrate in a spinning plane to centrifugally reduce the pre-wetting fluid at a surface of the substrate,- rotating the rotor unit with the substrate normal to the spinning plane so that the substrate faces away from the pre-wetting chamber,- moving the rotor unit with the substrate into an electroplating chamber of the process station,- applying an electrolyte liquid and an electric current to the substrate for an electroplating process on the substrate in the electroplating chamber, and- moving the rotor unit with the substrate at least partially out of the electroplating chamber.

IPC 8 full level

C25D 5/02 (2006.01); C25D 5/34 (2006.01); C25D 7/00 (2006.01); C25D 17/00 (2006.01); C25D 17/06 (2006.01); C25D 21/12 (2006.01)

CPC (source: CN EP KR US)

C25D 5/00 (2013.01 - CN); C25D 5/02 (2013.01 - EP KR); C25D 5/04 (2013.01 - US); C25D 5/34 (2013.01 - CN EP KR US); C25D 5/54 (2013.01 - CN); C25D 7/00 (2013.01 - EP KR); C25D 17/00 (2013.01 - EP); C25D 17/06 (2013.01 - CN EP KR); C25D 17/08 (2013.01 - US); C25D 21/04 (2013.01 - US); C25D 21/08 (2013.01 - KR); C25D 21/10 (2013.01 - CN); C25D 21/12 (2013.01 - EP)

Citation (applicant)

US 2015179458 A1 20150625 - MAYER STEVEN T [US], et al

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3885474 A1 20210929; CN 114026272 A 20220208; CN 114026272 B 20240618; JP 2023518573 A 20230502; KR 20220016971 A 20220210; SG 11202113072P A 20211230; TW 202229656 A 20220801; TW I788831 B 20230101; US 2023095518 A1 20230330; WO 2021190804 A1 20210930

DOCDB simple family (application)

EP 20165608 A 20200325; CN 202180004200 A 20210127; EP 2021051872 W 20210127; JP 2022557916 A 20210127; KR 20227000235 A 20210127; SG 11202113072P A 20210127; TW 110115814 A 20210430; US 202117908695 A 20210127