EP 3885969 A4 20220126 - FINGERPRINT RECOGNITION METHOD, FINGERPRINT RECOGNITION DEVICE AND ELECTRONIC APPARATUS
Title (en)
FINGERPRINT RECOGNITION METHOD, FINGERPRINT RECOGNITION DEVICE AND ELECTRONIC APPARATUS
Title (de)
FINGERABDRUCKERKENNUNGSVERFAHREN, FINGERABDRUCKERKENNUNGSVORRICHTUNG UND ELEKTRONISCHE VORRICHTUNG
Title (fr)
PROCÉDÉ DE RECONNAISSANCE D'EMPREINTES DIGITALES, DISPOSITIF DE RECONNAISSANCE D'EMPREINTES DIGITALES ET APPAREIL ÉLECTRONIQUE
Publication
Application
Priority
CN 2019112314 W 20191021
Abstract (en)
[origin: EP3885969A1] A method for identifying a fingerprint, a fingerprint identification apparatus and an electronic device are provided. The method includes: acquiring light signals in multiple directions reflected via a sampled object above a display screen; generating a plurality of two-dimensional 2D fingerprint images respectively based on the light signals in the multiple directions; determining whether the sampled object is a three-dimensional 3D object based on the plurality of 2D fingerprint images; and if the sampled object is the 3D object, performing fingerprint identification based on at least one of the plurality of 2D fingerprint images. A distinction between a 2D object and a 3D object is effectively achieved through the light signals in the multiple directions, and when the sampled object is a 3D object, subsequent fingerprint identification is performed, which fundamentally avoids performing the fingerprint identification based on a fake fingerprint captured by a 2D object, thereby improving security of the fingerprint identification.
IPC 8 full level
G06K 9/00 (2022.01)
CPC (source: CN EP KR US)
G06V 20/64 (2022.01 - CN); G06V 40/13 (2022.01 - CN); G06V 40/1318 (2022.01 - EP KR US); G06V 40/1347 (2022.01 - CN); G06V 40/1365 (2022.01 - CN EP KR US)
Citation (search report)
- [XI] US 2019180071 A1 20190613 - KIM HYUNJOON [KR]
- [I] US 2019034020 A1 20190131 - HE YI [US], et al
- [I] EP 2047622 B1 20190522 - HID GLOBAL CORP [US]
- [I] US 6292576 B1 20010918 - BROWNLEE KENNETH [US]
- [I] US 2018225498 A1 20180809 - SETLAK DALE R [US]
- [E] US 2020292741 A1 20200917 - RHEE BONG JAE [KR], et al & WO 2019066414 A1 20190404 - SAMSUNG ELECTRONICS CO LTD [KR]
- See also references of WO 2021077259A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3885969 A1 20210929; EP 3885969 A4 20220126; EP 3885969 B1 20231220; CN 110945524 A 20200331; CN 110945524 B 20210917; CN 113869206 A 20211231; KR 102610600 B1 20231205; KR 20210096202 A 20210804; US 11455826 B2 20220927; US 2021319207 A1 20211014; WO 2021077259 A1 20210429
DOCDB simple family (application)
EP 19949884 A 20191021; CN 2019112314 W 20191021; CN 201980002364 A 20191021; CN 202111138385 A 20191021; KR 20217020093 A 20191021; US 202117358926 A 20210625