Title (en)

POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME

Title (de)

POLIERPADS SOWIE SYSTEME UND VERFAHREN ZUR HERSTELLUNG UND VERWENDUNG DAVON

Title (fr)

TAMPONS À POLIR, SYSTÈMES ET PROCÉDÉS DE FABRICATION ET D'UTILISATION DE TELS TAMPONS À POLIR

Publication

EP 3887093 A4 20220817 (EN)

Application

EP 19890633 A 20191122

Priority

• US 201862771738 P 20181127
• IB 2019060064 W 20191122

Abstract (en)

[origin: WO2020109947A1] A polishing pad includes a polishing layer having a first major surface and a second major surface opposite the first major surface. The polishing pad further includes a subpad, which is coupled to the polishing layer, and has a first major surface and a second major surface opposite the first major surface. At least 50% of the subpad, based on the total surface area of the first major surface of the subpad, is optically transparent.

IPC 8 full level

B24B 37/00 (2012.01); B24B 1/00 (2006.01); B24B 29/00 (2006.01); B24B 37/04 (2012.01); B24B 37/22 (2012.01); B24B 37/24 (2012.01)

CPC (source: EP KR US)

B24B 37/04 (2013.01 - EP KR US); B24B 37/22 (2013.01 - EP KR US); B24B 37/24 (2013.01 - EP KR US)

Citation (search report)

• [XYI] WO 2015127077 A1 20150827 - THOMAS WEST INC [US]
• [XYI] US 2015325451 A1 20151112 - MRZYGLOD BRIAN [US], et al
• [X] US 2005197050 A1 20050908 - PRASAD ABANESHWAR [US], et al
• [Y] US 2015298286 A1 20151022 - NAKAMURA KENJI [JP]
• See references of WO 2020109947A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2020109947 A1 20200604; EP 3887093 A1 20211006; EP 3887093 A4 20220817; JP 2022511763 A 20220201; KR 20210094024 A 20210728; TW 202033310 A 20200916; US 2022023991 A1 20220127

DOCDB simple family (application)

IB 2019060064 W 20191122; EP 19890633 A 20191122; JP 2021529686 A 20191122; KR 20217019427 A 20191122; TW 108142872 A 20191126; US 201917297221 A 20191122