EP 3888909 A4 20220824 - ADHESIVE AGENT COMPOSITION, LAYERED PRODUCT AND PRODUCTION METHOD FOR LAYERED PRODUCT, AND METHOD FOR REDUCING THICKNESS OF SEMICONDUCTOR FORMING SUBSTRATE
Title (en)
ADHESIVE AGENT COMPOSITION, LAYERED PRODUCT AND PRODUCTION METHOD FOR LAYERED PRODUCT, AND METHOD FOR REDUCING THICKNESS OF SEMICONDUCTOR FORMING SUBSTRATE
Title (de)
KLEBSTOFFZUSAMMENSETZUNG, SCHICHTPRODUKT UND HERSTELLUNGSVERFAHREN FÜR EIN SCHICHTPRODUKT SOWIE VERFAHREN ZUR VERRINGERUNG DER DICKE EINES HALBLEITERSUBSTRATS
Title (fr)
COMPOSITION D'AGENT ADHÉSIF, PRODUIT EN COUCHES ET PROCÉDÉ DE PRODUCTION POUR PRODUIT EN COUCHES, ET PROCÉDÉ DE RÉDUCTION D'ÉPAISSEUR DE SUBSTRAT DE FORMATION DE SEMI-CONDUCTEUR
Publication
Application
Priority
- JP 2018222885 A 20181128
- JP 2019046201 W 20191126
Abstract (en)
[origin: EP3888909A1] An adhesive composition for forming an adhesive layer that can bond a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate in a peelable manner, the composition containing a component (A) which is cured through hydrosilylation and a peeling component (B) which contains a component containing an epoxy-modified polyorganosiloxane, wherein the component (A) contains a polysiloxane (A1) including a siloxane unit represented by SiO<sub>2</sub> (unit Q) and the like, and a platinum group metal catalyst (A2); and the polysiloxane (A1) contains a polyorganosiloxane (a1) including a siloxane unit represented by SiO<sub>2</sub> (unit Q') and the like, and a polyorganosiloxane (a2) including a siloxane unit represented by SiO<sub>2</sub> (unit Q") and the like, and having a functional group (Si-H) content of 5.0 mol/kg or greater.
IPC 8 full level
B32B 27/00 (2006.01); B32B 7/12 (2006.01); C09J 11/06 (2006.01); C09J 183/04 (2006.01); C09J 183/05 (2006.01); C09J 183/07 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP KR US)
B32B 37/12 (2013.01 - EP KR US); C08L 83/06 (2013.01 - KR); C09J 7/401 (2018.01 - KR US); C09J 11/06 (2013.01 - KR); C09J 183/04 (2013.01 - EP KR US); H01L 21/304 (2013.01 - KR); H01L 21/6835 (2013.01 - EP US); H01L 21/6836 (2013.01 - KR US); B05D 3/02 (2013.01 - US); B32B 38/0036 (2013.01 - EP); B32B 2037/1253 (2013.01 - EP); B32B 2038/0076 (2013.01 - EP); B32B 2309/12 (2013.01 - EP); B32B 2457/14 (2013.01 - EP); C08G 77/12 (2013.01 - EP); C08G 77/14 (2013.01 - EP); C08G 77/20 (2013.01 - EP); C08G 77/70 (2013.01 - EP); C09J 2203/326 (2013.01 - KR US); H01L 2221/68327 (2013.01 - EP KR); H01L 2221/6834 (2013.01 - EP)
C-Set (source: EP US)
EP
- C09J 183/04 + C08K 5/0025 + C08L 83/00 + C08L 83/00
- C09J 183/04 + C08L 83/00 + C08L 83/00 + C08K 5/56
US
Citation (search report)
- [XP] WO 2018216732 A1 20181129 - NISSAN CHEMICAL CORP [JP] & US 2020109325 A1 20200409 - SAWADA KAZUHIRO [JP], et al
- [XP] WO 2019212008 A1 20191107 - NISSAN CHEMICAL CORP [JP] & US 2021130666 A1 20210506 - SAWADA KAZUHIRO [JP], et al
- [I] JP 2014525953 A 20141002
- See also references of WO 2020111069A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3888909 A1 20211006; EP 3888909 A4 20220824; CN 113165344 A 20210723; CN 113165344 B 20230912; JP 7460963 B2 20240403; JP WO2020111069 A1 20211014; KR 20210096144 A 20210804; SG 11202105574Y A 20210629; TW 202031854 A 20200901; TW I834767 B 20240311; US 11776837 B2 20231003; US 2022025236 A1 20220127; WO 2020111069 A1 20200604
DOCDB simple family (application)
EP 19891103 A 20191126; CN 201980077764 A 20191126; JP 2019046201 W 20191126; JP 2020557742 A 20191126; KR 20217018945 A 20191126; SG 11202105574Y A 20191126; TW 108143259 A 20191127; US 201917297174 A 20191126