Global Patent Index - EP 3891515 A1

EP 3891515 A1 20211013 - METHOD FOR ELECTRICALLY EXAMINING ELECTRONIC COMPONENTS OF AN INTEGRATED CIRCUIT

Title (en)

METHOD FOR ELECTRICALLY EXAMINING ELECTRONIC COMPONENTS OF AN INTEGRATED CIRCUIT

Title (de)

VERFAHREN ZUR ELEKTRISCHEN UNTERSUCHUNG VON ELEKTRONISCHEN BAUELEMENTEN EINES INTEGRIERTEN SCHALTKREISES

Title (fr)

PROCÉDÉ D'EXAMEN ÉLECTRIQUE DE COMPOSANTS ÉLECTRONIQUES D'UN CIRCUIT INTÉGRÉ

Publication

EP 3891515 A1 20211013 (DE)

Application

EP 19809377 A 20191108

Priority

  • DE 102018009623 A 20181207
  • DE 2019000295 W 20191108

Abstract (en)

[origin: WO2020114533A1] The invention relates to a method for electrically examining electronic components of an integrated circuit. According to the invention, a method for electrically examining electronic components of an integrated circuit (1) is provided, comprising a target region (3) to be examined, in which electronic components having contact points (5) are located, and a residual region referred to as non-target region (2), in which an examination is carried out using a combined SEM/AFM nanaprobe. In a first step, the non-target region (2) is at least partially imaged with the scanning electron microscope part of the SEM/AFM nanaprobe, and in a subsequent step, the target region (3) is at least partially imaged with the scanning force microscope part of the SEM/AFM nanaprobe.

IPC 8 full level

G01Q 30/02 (2010.01); G01Q 60/30 (2010.01); H01J 37/28 (2006.01)

CPC (source: EP US)

G01Q 30/02 (2013.01 - EP US); G01Q 60/30 (2013.01 - EP); H01J 37/28 (2013.01 - EP US); H01J 2237/2583 (2013.01 - EP); H01J 2237/2814 (2013.01 - EP); H01J 2237/2817 (2013.01 - EP)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

DE 102018009623 A1 20200610; DE 102018009623 B4 20210318; EP 3891515 A1 20211013; EP 4398282 A2 20240710; EP 4398282 A3 20241009; US 12007408 B2 20240611; US 2022244290 A1 20220804; WO 2020114533 A1 20200611

DOCDB simple family (application)

DE 102018009623 A 20181207; DE 2019000295 W 20191108; EP 19809377 A 20191108; EP 24169826 A 20191108; US 201917295052 A 20191108