EP 3918631 A1 20211208 - DEVICE AND METHOD FOR TREATING WAFERS
Title (en)
DEVICE AND METHOD FOR TREATING WAFERS
Title (de)
VORRICHTUNG UND VERFAHREN ZUR BEARBEITUNG VON WAFERN
Title (fr)
DISPOSITIF ET PROCÉDÉ DE TRAITEMENT DE PLAQUETTES
Publication
Application
Priority
- DE 102019102492 A 20190131
- EP 2020052344 W 20200130
Abstract (en)
[origin: WO2020157229A1] The present invention relates to a device and method for treating wafers. According to the invention, the wafers are transported in vertical alignment through the process solution used for treating the wafers, as a result of which it is possible to increase the throughput, simplify the after-treatment of the exhaust air, and reduce the consumption of components in the process solution. The invention can be used, inter alia, in the production of solar cells, or of printed circuit boards, for example printed circuit boards for the electrical industry.
IPC 8 full level
C09K 13/08 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC (source: EP KR US)
H01L 21/4846 (2013.01 - US); H01L 21/67086 (2013.01 - EP KR US); H01L 21/67754 (2013.01 - US); H01L 21/6776 (2013.01 - EP KR US); H01L 31/1876 (2013.01 - US); H01L 21/67751 (2013.01 - EP KR); H01L 31/02363 (2013.01 - KR); H01L 31/18 (2013.01 - KR); Y02E 10/50 (2013.01 - EP); Y02P 70/50 (2015.11 - EP)
Citation (search report)
See references of WO 2020157229A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2020157229 A1 20200806; CN 113544835 A 20211022; DE 102019102492 A1 20200806; EP 3918631 A1 20211208; JP 2022524293 A 20220502; KR 20210120004 A 20211006; US 2022173265 A1 20220602
DOCDB simple family (application)
EP 2020052344 W 20200130; CN 202080019509 A 20200130; DE 102019102492 A 20190131; EP 20703704 A 20200130; JP 2021544565 A 20200130; KR 20217024624 A 20200130; US 202017425802 A 20200130