Global Patent Index - EP 3921460 A1

EP 3921460 A1 20211215 - ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELECTRONICS

Title (en)

ELECTRODEPOSITION OF A COBALT OR COPPER ALLOY, AND USE IN MICROELECTRONICS

Title (de)

GALVANISCHE ABSCHEIDUNG EINER KOBALT- ODER KUPFERLEGIERUNG UND VERWENDUNG IN DER MIKROELEKTRONIK

Title (fr)

ÉLECTRODÉPOSITION D'UN ALLIAGE DE COBALT OU DE CUIVRE ET SON UTILISATION EN MICROÉLECTRONIQUE

Publication

EP 3921460 A1 20211215 (EN)

Application

EP 20702499 A 20200206

Priority

  • FR 1901264 A 20190208
  • FR 2000297 A 20200114
  • EP 2020053018 W 20200206

Abstract (en)

[origin: TW202045778A] The present invention relates to a process for fabricating cobalt or copper interconnects, and to an electrolyte enabling implementation of said process. The electrolyte, with a pH of less than 4.0, comprises cobalt or copper ions, chloride ions, manganese or zinc ions, and at most two organic additives of low molecular mass. One of these additives may be an alpha-hydroxy carboxylic acid.

IPC 8 full level

C25D 3/56 (2006.01); C25D 5/34 (2006.01); C25D 5/50 (2006.01); C25D 7/12 (2006.01); H01L 21/768 (2006.01)

CPC (source: EP IL KR)

C25D 3/562 (2013.01 - EP IL KR); C25D 3/58 (2013.01 - EP IL KR); C25D 5/18 (2013.01 - EP IL KR); C25D 5/34 (2013.01 - EP); C25D 5/50 (2013.01 - EP IL KR); C25D 7/123 (2013.01 - EP IL KR); H01L 21/2885 (2013.01 - EP IL KR); H01L 21/76867 (2013.01 - EP IL KR); H01L 21/76877 (2013.01 - EP IL KR); H01L 21/76883 (2013.01 - EP IL KR); H01L 21/76897 (2013.01 - EP); H01L 23/53209 (2013.01 - EP IL KR); H01L 23/53238 (2013.01 - EP IL KR)

Citation (search report)

See references of WO 2020161256A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

FR 3092590 A1 20200814; CN 113383115 A 20210910; EP 3921460 A1 20211215; FR 3092589 A1 20200814; IL 284987 A 20210930; KR 102562159 B1 20230801; KR 20210124422 A 20211014; TW 202045778 A 20201216

DOCDB simple family (application)

FR 2000297 A 20200114; CN 202080012535 A 20200206; EP 20702499 A 20200206; FR 1901264 A 20190208; IL 28498721 A 20210720; KR 20217028826 A 20200206; TW 109103941 A 20200207