Global Patent Index - EP 3931952 A1

EP 3931952 A1 20220105 - METHOD AND DEVICE FOR FORMING A CONDUCTOR STACK AND INSERTING THE SAME INTO A LAMINATION STACK

Title (en)

METHOD AND DEVICE FOR FORMING A CONDUCTOR STACK AND INSERTING THE SAME INTO A LAMINATION STACK

Title (de)

VERFAHREN UND VORRICHTUNG ZUM FORMEN EINES LEITERPAKETS UND EINSETZEN DESSELBEN IN EIN BLECHPAKET

Title (fr)

PROCÉDÉ ET DISPOSITIF DE FAÇONNAGE D'UN BLOC IMPRIMÉ ET INSERTION DE CELUI-CI DANS UN PAQUET DE TÔLES

Publication

EP 3931952 A1 20220105 (DE)

Application

EP 20717073 A 20200228

Priority

  • AT 501652019 A 20190301
  • AT 2020060057 W 20200228

Abstract (en)

[origin: WO2020176916A1] The invention relates to a method and a forming and inserting unit (24) for creating a conductor stack (6) for insertion into a lamination stack (1), the conductor stack comprising at least one conductor element group (7, 8, 9) composed of a plurality of conductor elements (10, 11, 12). The conductor elements (10, 11, 12) are inserted into a forming and inserting tool (25) in receiving grooves (30, 32) provided therein and defined by retaining elements (29, 31), and are held in position in said receiving grooves. Subsequently, the forming process of the conductor elements (10, 11, 12) is carried out. The formed conductor elements (10, 11, 12) are still held in position by an inner tool (27) and an outer tool (26) of the forming and inserting tool (25) and are inserted into the lamination stack (1) directly by means of said inner tool and outer tool.

IPC 8 full level

H02K 15/04 (2006.01)

CPC (source: AT EP)

H02K 15/0428 (2013.01 - AT EP); H02K 15/064 (2013.01 - AT)

Citation (search report)

See references of WO 2020176916A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2020176916 A1 20200910; AT 522207 A1 20200915; CN 113330669 A 20210831; EP 3931952 A1 20220105

DOCDB simple family (application)

AT 2020060057 W 20200228; AT 501652019 A 20190301; CN 202080010174 A 20200228; EP 20717073 A 20200228