EP 3943215 A4 20221214 - METAL PASTE, BONDING METHOD AND METHOD FOR PRODUCING BONDED BODY
Title (en)
METAL PASTE, BONDING METHOD AND METHOD FOR PRODUCING BONDED BODY
Title (de)
KUPFERPASTE, VERBINDUNGSVERFAHREN UND VERFAHREN ZUR HERSTELLUNG EINES GEBUNDENEN KÖRPERS
Title (fr)
PÂTE MÉTALLIQUE, PROCÉDÉ DE LIAISON ET PROCÉDÉ DE PRODUCTION D'UN CORPS LIÉ
Publication
Application
Priority
- JP 2019055538 A 20190322
- JP 2020012389 W 20200319
Abstract (en)
[origin: EP3943215A1] A metal paste for low temperature bonding at temperatures 600°C or lower, the metal paste comprising: a metal particle with an average particle size of 1 to 100 µm; a metal nanoparticle with an average particle size of 1 to 500 nm; a stress relieving material; and a dispersion medium to disperse the metal particle, metal nanoparticle, and the stress relieving material.
IPC 8 full level
B22F 1/00 (2022.01); B22F 1/07 (2022.01); B22F 1/107 (2022.01); B22F 1/16 (2022.01); B22F 7/04 (2006.01); B22F 7/06 (2006.01); B22F 7/08 (2006.01); C22C 1/10 (2006.01); C22C 5/02 (2006.01); C22C 5/06 (2006.01); C22C 9/00 (2006.01)
CPC (source: EP US)
B22F 1/00 (2013.01 - EP US); B22F 1/07 (2022.01 - EP US); B22F 1/09 (2022.01 - EP US); B22F 1/107 (2022.01 - EP US); B22F 1/16 (2022.01 - EP US); B22F 7/04 (2013.01 - EP); B22F 7/064 (2013.01 - EP US); C22C 1/10 (2013.01 - EP); C22C 5/02 (2013.01 - EP); C22C 5/06 (2013.01 - EP); C22C 9/00 (2013.01 - EP); B22F 2007/047 (2013.01 - EP); B22F 2301/10 (2013.01 - US); B22F 2301/255 (2013.01 - US); B22F 2304/054 (2013.01 - US); B22F 2304/056 (2013.01 - US); B22F 2304/058 (2013.01 - US); B22F 2998/10 (2013.01 - EP); B22F 2999/00 (2013.01 - EP)
C-Set (source: EP US)
EP
- B22F 2999/00 + B22F 1/07 + B22F 1/16
- B22F 2999/00 + B22F 1/052 + B22F 1/0545
- B22F 2998/10 + B22F 7/064 + B22F 3/10
US
Citation (search report)
- [X] US 2018033760 A1 20180201 - ISHIKAWA SHINJI [JP], et al
- [XY] US 2014287158 A1 20140925 - HEYEN JANET [US], et al
- [XY] JP 2006196245 A 20060727 - SUMITOMO ELECTRIC INDUSTRIES
- [Y] CN 107025950 A 20170808 - LI WENXI, et al
- See references of WO 2020196299A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3943215 A1 20220126; EP 3943215 A4 20221214; CN 113613811 A 20211105; JP WO2020196299 A1 20201001; TW 202100266 A 20210101; US 2022143692 A1 20220512; WO 2020196299 A1 20201001
DOCDB simple family (application)
EP 20778568 A 20200319; CN 202080023192 A 20200319; JP 2020012389 W 20200319; JP 2021509327 A 20200319; TW 109109288 A 20200319; US 202017438676 A 20200319