Global Patent Index - EP 3947785 A1

EP 3947785 A1 20220209 - PRETREATMENT METHOD FOR PRETREATING COMPONENTS PRIOR TO ELECTROPLATING

Title (en)

PRETREATMENT METHOD FOR PRETREATING COMPONENTS PRIOR TO ELECTROPLATING

Title (de)

VORBEHANDLUNGSVERFAHREN ZUM VORBEHANDELN VON BAUTEILEN VOR EINEM GALVANISCHEN BESCHICHTEN

Title (fr)

PROCÉDÉ DE PRÉTRAITEMENT POUR LE PRÉTRAITEMENT DE COMPOSANTS AVANT UN REVÊTEMENT GALVANIQUE

Publication

EP 3947785 A1 20220209 (DE)

Application

EP 20713239 A 20200318

Priority

  • DE 102019204225 A 20190327
  • EP 2020057417 W 20200318

Abstract (en)

[origin: WO2020193307A1] The invention relates to a pretreatment method (A) for pretreating components (10), which are each formed from at least two different materials, prior to coating. The pretreatment method (A) comprises the following steps: alkaline degreasing (1); chemical pickling (2) in a first pickling medium; anodic pickling (3) in a second pickling medium; and cathodic degreasing (4).

IPC 8 full level

C25D 5/36 (2006.01); C25D 7/00 (2006.01); C25D 7/04 (2006.01); C25F 1/06 (2006.01); H01T 13/00 (2006.01); H01T 21/00 (2006.01)

CPC (source: EP US)

C23G 1/00 (2013.01 - EP); C23G 1/08 (2013.01 - EP US); C23G 1/19 (2013.01 - US); C25D 5/36 (2013.01 - EP US); C25D 7/003 (2013.01 - US); C25D 7/04 (2013.01 - EP US); C25D 17/08 (2013.01 - US); C25D 17/10 (2013.01 - US); C25F 1/00 (2013.01 - EP); C25F 1/06 (2013.01 - EP US); H01T 13/32 (2013.01 - EP); H01T 13/39 (2013.01 - EP); H01T 21/02 (2013.01 - US); H01T 21/04 (2013.01 - EP); C25D 7/003 (2013.01 - EP); C25D 17/06 (2013.01 - EP); C25D 17/10 (2013.01 - EP)

Citation (search report)

See references of WO 2020193307A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2020193307 A1 20201001; CN 113574210 A 20211029; DE 102019204225 A1 20201001; EP 3947785 A1 20220209; JP 2022525782 A 20220519; JP 7279187 B2 20230522; US 2022190562 A1 20220616

DOCDB simple family (application)

EP 2020057417 W 20200318; CN 202080024044 A 20200318; DE 102019204225 A 20190327; EP 20713239 A 20200318; JP 2021556474 A 20200318; US 202017442430 A 20200318