EP 3950175 A1 20220209 - BONDING MATERIAL AND BONDED STRUCTURE
Title (en)
BONDING MATERIAL AND BONDED STRUCTURE
Title (de)
VERBINDUNGSMATERIAL UND VERBUNDENE STRUKTUR
Title (fr)
MATÉRIAU DE LIAISON, ET STRUCTURE DE LIAISON
Publication
Application
Priority
- JP 2019068289 A 20190329
- JP 2020008654 W 20200302
Abstract (en)
A bonding material of the present invention includes: a copper foil; and a sinterable bonding film formed on one surface of the copper foil. The bonding film contains a copper powder and a solid reducing agent. The bonding material is used for bonding to a bonding target having, on its surface, at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum. The bonding material of the present invention is also used as a material for wire bonding. The present invention also provides a bonded structure in which a bonding target having a metal layer formed on its surface and a copper foil are electrically connected to each other via a bonding layer formed of a sintered structure of a copper powder, wherein the metal layer contains at least one metal selected from the group consistin of gold, silver, copper, nickel, and aluminum.
IPC 8 full level
B22F 1/052 (2022.01); B22F 1/054 (2022.01); B22F 1/068 (2022.01); B22F 1/107 (2022.01); B22F 7/00 (2006.01); B22F 7/06 (2006.01); B22F 7/08 (2006.01)
CPC (source: EP KR US)
B22F 1/052 (2022.01 - EP KR US); B22F 1/054 (2022.01 - EP KR US); B22F 1/0551 (2022.01 - EP KR US); B22F 1/056 (2022.01 - EP KR US); B22F 1/068 (2022.01 - EP KR US); B22F 1/107 (2022.01 - EP KR US); B22F 1/147 (2022.01 - EP KR US); B22F 7/008 (2013.01 - EP); B22F 7/064 (2013.01 - EP); B22F 7/08 (2013.01 - EP KR US); B23K 35/0238 (2013.01 - US); B23K 35/302 (2013.01 - US); B32B 15/01 (2013.01 - US); C22C 1/0425 (2013.01 - KR); H01L 23/14 (2013.01 - KR); H01L 24/29 (2013.01 - US); H01L 24/45 (2013.01 - US); H01R 4/02 (2013.01 - KR); B22F 2007/042 (2013.01 - KR); B22F 2301/10 (2013.01 - US); B22F 2999/00 (2013.01 - EP); H01L 2224/29124 (2013.01 - US); H01L 2224/29139 (2013.01 - US); H01L 2224/29144 (2013.01 - US); H01L 2224/29147 (2013.01 - US); H01L 2224/29155 (2013.01 - US); H01L 2224/45147 (2013.01 - US)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3950175 A1 20220209; EP 3950175 A4 20220209; CN 113631301 A 20211109; CN 113631301 B 20240430; JP 7455114 B2 20240325; JP WO2020202971 A1 20201008; KR 20210144677 A 20211130; SG 11202109544S A 20211028; TW 202104481 A 20210201; US 2022157765 A1 20220519; WO 2020202971 A1 20201008
DOCDB simple family (application)
EP 20783002 A 20200302; CN 202080023565 A 20200302; JP 2020008654 W 20200302; JP 2021511265 A 20200302; KR 20217028288 A 20200302; SG 11202109544S A 20200302; TW 109107670 A 20200309; US 202017435846 A 20200302