EP 3957489 B1 20221102 - DEVELOPER-FREE THERMOSENSITIVE RECORDING MATERIAL
Title (en)
DEVELOPER-FREE THERMOSENSITIVE RECORDING MATERIAL
Title (de)
ENTWICKLERFREIES WÄRMEEMPFINDLICHES AUFZEICHNUNGSMATERIAL
Title (fr)
MATIÈRE D'ENREGISTREMENT THERMOSENSIBLE SANS GÉNÉRATEUR
Publication
Application
Priority
EP 20191808 A 20200819
Abstract (en)
[origin: CA3128553A1] The present invention relates to a heat-sensitive recording material comprising or consisting of a) a carrier substrate (preferably paper substrate) and b) a fusible layer disposed on one side of the carrier substrate or paper substrate, wherein the fusible layer comprises or consists of i) an amide wax having a melting point in the range from 60 C to 180 C, ii) an inorganic pigment and iii) a polymeric binder. The present invention additionally relates to a coating composition for producing a corresponding fusible layer, to a process for producing a heat-sensitive recording material and to the use of a heat-sensitive recording material.
IPC 8 full level
B41M 5/36 (2006.01)
CPC (source: EP US)
B41M 5/361 (2013.01 - EP US); B41M 5/363 (2013.01 - EP US); B41M 5/36 (2013.01 - EP); B41M 2205/04 (2013.01 - EP US)
Citation (opposition)
Opponent : Koehler Innovation & Technology GmbH
- US 2014037901 A1 20140206 - CHUNG CHAO-JEN [US], et al
- EP 0164074 A2 19851211 - MITSUBISHI PAPER MILLS LTD [JP]
- JP 2002356072 A 20021210 - FUJI PHOTO FILM CO LTD
- JP 2005189541 A 20050714 - FUJI PHOTO FILM CO LTD
- EP 2993054 A1 20160309 - MITSUBISHI HITEC PAPER EUROPE [DE]
- EP 2993055 A1 20160309 - MITSUBISHI HITEC PAPER EUROPE [DE]
- US 4273602 A 19810616 - KOSAKA TAKAO, et al
- US 4587537 A 19860506 - MIYAUCHI MASAHIRO [JP], et al
- US 4643917 A 19870217 - KOSHIZUKA KUNIHIRO [JP], et al
- DE 102018101109 A1 20190718 - MITSUBISHI HITEC PAPER EUROPE GMBH [DE]
- US 2012274059 A1 20121101 - MORONUKI KATSUMI [JP], et al
- JP 2000118150 A 20000425 - FUJI PHOTO FILM CO LTD
- JP 2009023125 A 20090205 - MITSUBISHI PAPER MILLS LTD
- US 2019077178 A1 20190314 - BRASCH UWE [DE], et al
Opponent : Mitsubishi HiTec Paper Europe GmbH
- JÁNOS HAJAS: "Amidwachse", RÖMPP, THIEME, 1 December 2007 (2007-12-01), pages 1 - 2, XP093168592, Retrieved from the Internet <URL:https://roempp.thieme.de/F8YLC >
- HAJAS JÁNOS, HEYDT HEINRICH, SCHIEBER ANDREAS: "Wachse", RÖMPP, 1 December 2007 (2007-12-01), pages 1 - 5, XP093093562, Retrieved from the Internet <URL:https://roempp.thieme.de/VTLA5> [retrieved on 20231020]
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3957489 A1 20220223; EP 3957489 B1 20221102; AU 2021218068 A1 20220310; CA 3128553 A1 20220219; EP 4163119 A1 20230412; ES 2937111 T3 20230324; FI 3957489 T3 20230131; PL 3957489 T3 20230320; PT 3957489 T 20221206; US 2022055389 A1 20220224
DOCDB simple family (application)
EP 20191808 A 20200819; AU 2021218068 A 20210818; CA 3128553 A 20210817; EP 22204860 A 20200819; ES 20191808 T 20200819; FI 20191808 T 20200819; PL 20191808 T 20200819; PT 20191808 T 20200819; US 202117405159 A 20210818