EP 3962984 A1 20220309 - CURING COMPOSITION FOR AN EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION, AND MULTI-COMPONENT EPOXY RESIN SYSTEM WITH IMPROVED LOW TEMPERATURE CURING
Title (en)
CURING COMPOSITION FOR AN EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION, AND MULTI-COMPONENT EPOXY RESIN SYSTEM WITH IMPROVED LOW TEMPERATURE CURING
Title (de)
HÄRTERZUSAMMENSETZUNG FÜR EINE EPOXIDHARZMASSE, EPOXIDHARZMASSE UND MEHRKOMPONENTEN-EPOXIDHARZSYSTEM MIT VERBESSERTER TIEFTEMPERATURHÄRTUNG
Title (fr)
COMPOSITION DE DURCISSEUR POUR RÉSINE ÉPOXYDE, RÉSINE ÉPOXYDE ET SYSTÈME DE RÉSINE ÉPOXYDE À PLUSIEURS COMPOSANTS AYANT UN MEILLEUR DURCISSEMENT À BASSE TEMPÉRATURE
Publication
Application
Priority
- EP 19171884 A 20190430
- EP 2020060954 W 20200420
Abstract (en)
[origin: CA3132925A1] The invention relates to a curing composition for a multi-component epoxy resin composition for chemically fixing construction elements, an epoxy resin composition and a multi-component epoxy resin system. The invention further relates to a method for chemically fixing construction elements in boreholes. The invention also relates to the use of a combination of a salt (S) with a phenol derivative for chemically fixing construction elements, in particular at low temperatures (= 0 °C), for improving the curing and the extraction resistance.
IPC 8 full level
C08G 59/50 (2006.01); C08G 59/62 (2006.01); C08G 59/68 (2006.01)
CPC (source: EP KR US)
C08G 59/50 (2013.01 - EP KR); C08G 59/5006 (2013.01 - EP KR US); C08G 59/5026 (2013.01 - EP KR US); C08G 59/5033 (2013.01 - EP KR US); C08G 59/5073 (2013.01 - EP KR US); C08G 59/621 (2013.01 - EP KR); C08G 59/68 (2013.01 - EP KR); C08G 59/686 (2013.01 - EP KR); C08G 59/687 (2013.01 - EP KR)
Citation (search report)
See references of WO 2020221608A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3733731 A1 20201104; AU 2020264706 A1 20210930; CA 3132925 A1 20201105; CN 113631624 A 20211109; CN 113631624 B 20231020; EP 3962984 A1 20220309; JP 2022532049 A 20220713; KR 20220002400 A 20220106; US 2022213259 A1 20220707; WO 2020221608 A1 20201105
DOCDB simple family (application)
EP 19171884 A 20190430; AU 2020264706 A 20200420; CA 3132925 A 20200420; CN 202080024898 A 20200420; EP 2020060954 W 20200420; EP 20718346 A 20200420; JP 2021564688 A 20200420; KR 20217037829 A 20200420; US 202017607021 A 20200420