EP 3966368 A1 20220316 - METHOD AND CRUCIBLE FOR PRODUCING PARTICLE-FREE AND NITROGEN-FREE SILICON INGOTS BY MEANS OF TARGETED SOLIDIFICATION, SILICON INGOT, AND THE USE OF THE CRUCIBLE
Title (en)
METHOD AND CRUCIBLE FOR PRODUCING PARTICLE-FREE AND NITROGEN-FREE SILICON INGOTS BY MEANS OF TARGETED SOLIDIFICATION, SILICON INGOT, AND THE USE OF THE CRUCIBLE
Title (de)
VERFAHREN UND TIEGEL ZUR HERSTELLUNG VON PARTIKEL- UND STICKSTOFF-FREIEN SILICIUM-INGOTS MITTELS GERICHTETER ERSTARRUNG, SILICIUM-INGOT UND DIE VERWENDUNG DES TIEGELS
Title (fr)
PROCÉDÉ ET CREUSET PERMETTANT LA PRODUCTION DE LINGOTS DE SILICIUM EXEMPTS DE PARTICULES ET D'AZOTE PAR SOLIDIFICATION ORIENTÉE, LINGOT DE SILICIUM ET UTILISATION DU CREUSET
Publication
Application
Priority
- DE 102019206489 A 20190506
- EP 2020062408 W 20200505
Abstract (en)
[origin: WO2020225244A1] The present invention relates to a method and to a crucible for producing particle-free and nitrogen-free silicon ingots by means of targeted solidification, in which method a crucible is provided, the inner surface of the crucible having a coating containing SixNy over its full surface or at least in regions, which coating is coated with a protective layer containing SiOx in order to reduce or prevent the introduction of nitrogen and SixNy particles into the silicon. The invention also relates to a silicon ingot, which is virtually free from nitrogen or SixNy particles.
IPC 8 full level
C30B 11/00 (2006.01); C30B 29/06 (2006.01); C30B 35/00 (2006.01)
CPC (source: EP US)
C04B 41/009 (2013.01 - EP); C04B 41/52 (2013.01 - EP); C04B 41/89 (2013.01 - EP); C30B 29/06 (2013.01 - EP US); C30B 35/002 (2013.01 - EP US); C04B 2111/00879 (2013.01 - EP)
Citation (search report)
See references of WO 2020225244A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2020225244 A1 20201112; DE 102019206489 A1 20201112; EP 3966368 A1 20220316; JP 2022531716 A 20220708; US 2022213616 A1 20220707
DOCDB simple family (application)
EP 2020062408 W 20200505; DE 102019206489 A 20190506; EP 20724460 A 20200505; JP 2021566107 A 20200505; US 202017608627 A 20200505