EP 3967784 A1 20220316 - ALLOY MATERIAL AND PRODUCTION PROCESS THEREFOR
Title (en)
ALLOY MATERIAL AND PRODUCTION PROCESS THEREFOR
Title (de)
LEGIERUNGSMATERIAL UND HERSTELLUNGSVERFAHREN DAFÜR
Title (fr)
MATÉRIAU EN ALLIAGE ET PROCÉDÉ DE PRODUCTION ASSOCIÉ
Publication
Application
Priority
- CN 201910380080 A 20190508
- CN 2020089072 W 20200507
Abstract (en)
The present invention discloses an alloy material and a manufacturing process of its bars. The technical solution of the present invention is: an alloy material, wherein it comprises, in mass %:Si, 0.8-1.2%;Fe,0- 0.5%;Cu, 0.15-0.6%;Mn, 0.2-0.8%;Mg, 0.6-0.1%;Cr, 0-0.1%;Zn, 0-0.25%;Ti, 0-0.1%; the balance is Al<sub>∘</sub>The Si content is 1.11%. The Mn content is 0.69%.A manufacturing process of an alloy material, wherein it comprises the following steps:(1) Weighing the raw material of each component by mass percentage;(2) Placing the raw material in a melting furnace and smelt it into an alloy liquid, until the temperature of the alloy liquid reaches 705-750°C, keeping for 45-60 minutes;(3) After the alloy liquid temperature falls to 520-580°C, add refining agent, heat up to 670-710°C, and carry out composition inspection;(4). After the alloy liquid is cooled down to 650-660°C by holding, it is poured into molds where the bars are formed by cooling. According to the solution provided by the invention, the alloy has high tensile strength and yield strength.
IPC 8 full level
C22C 21/02 (2006.01); C22C 1/02 (2006.01); C22C 1/06 (2006.01)
CPC (source: CN EP US)
C22C 1/026 (2013.01 - CN EP US); C22C 1/06 (2013.01 - CN); C22C 21/02 (2013.01 - CN EP US); C22C 1/06 (2013.01 - EP); C22F 1/043 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
US 2021340649 A1 20211104; CN 110079709 A 20190802; EP 3967784 A1 20220316; EP 3967784 A4 20220810; JP 2022512995 A 20220207; WO 2020224627 A1 20201112
DOCDB simple family (application)
US 202017283017 A 20200507; CN 201910380080 A 20190508; CN 2020089072 W 20200507; EP 20802186 A 20200507; JP 2021525305 A 20200507