EP 3968459 A4 20230329 - WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Title (en)
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
Title (de)
LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG DER LEITERPLATTE
Title (fr)
CARTE DE CÂBLAGE ET PROCÉDÉ DE FABRICATION DE CARTE DE CÂBLAGE
Publication
Application
Priority
- JP 2019087631 A 20190507
- JP 2019087676 A 20190507
- JP 2020017139 W 20200421
Abstract (en)
[origin: EP3968459A1] A wiring board (10) includes a substrate (11) that is transparent, a wiring pattern region (20) disposed on the substrate (11) and having first-direction wiring lines (21), and a feeding unit (40) electrically connected to the first-direction wiring lines (21) of the wiring pattern region (20). Each first-direction wiring line (21) has a first region (26) positioned near the feeding unit (40) and a second region (27) that is a region other than the first region (26). A line width (W<sub>3</sub>) of the first-direction wiring line (21) in the first region (26) is larger than a line width (W<sub>1</sub>) of the first-direction wiring line (21) in the second region (27).
IPC 8 full level
H01Q 1/36 (2006.01); H01Q 1/38 (2006.01); H01Q 5/40 (2015.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01)
CPC (source: EP KR US)
H01Q 1/364 (2013.01 - EP); H01Q 1/38 (2013.01 - EP KR US); H01Q 5/40 (2015.01 - EP); H05K 1/02 (2013.01 - KR); H05K 1/025 (2013.01 - US); H05K 1/165 (2013.01 - EP); H05K 3/108 (2013.01 - US); H05K 3/18 (2013.01 - US); H05K 3/28 (2013.01 - KR); H05K 1/0274 (2013.01 - EP US); H05K 2201/0108 (2013.01 - EP); H05K 2201/09681 (2013.01 - EP); H05K 2201/0969 (2013.01 - EP); H05K 2201/09727 (2013.01 - EP US); H05K 2201/10098 (2013.01 - EP US)
Citation (search report)
- [A] JP 2008263265 A 20081030 - HITACHI CABLE
- [XI] FR 2955430 A1 20110722 - BOUYGUES TELECOM SA [FR], et al
- [X] US 2011227808 A1 20110922 - TAKANO TOSHIYUKI [JP], et al
- [X] KR 101971490 B1 20190423 - DONGWOO FINE CHEM CO LTD [KR] & US 2020251813 A1 20200806 - RYU HAN SUB [KR], et al
- [X] JP 2005142984 A 20050602 - SHINETSU POLYMER CO
- [A] US 2017352959 A1 20171207 - SUGITA YASUHIRO [JP], et al
- [A] CN 103515709 A 20140115 - HARBIN INST OF TECHNOLOGY
- [XAI] HUGLER PHILIPP ET AL: "Optically Transparent Patch Antennas at 77 GHz Using Meshed Aluminum", 2019 12TH GERMAN MICROWAVE CONFERENCE (GEMIC), IMA - INSTITUT FUR MIKROWELLEN- UND ANTENNENTECHNIK E.V, 25 March 2019 (2019-03-25), pages 186 - 189, XP033541383, DOI: 10.23919/GEMIC.2019.8698175
- [XAI] MARTIN ALEXIS ET AL: "60GHz optically transparent patch antenna arrays made of double-sided micrometric mesh metal layers", 2018 18TH INTERNATIONAL SYMPOSIUM ON ANTENNA TECHNOLOGY AND APPLIED ELECTROMAGNETICS (ANTEM), IEEE, 19 August 2018 (2018-08-19), pages 1 - 2, XP033471353, DOI: 10.1109/ANTEM.2018.8572996
- See also references of WO 2020226049A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3968459 A1 20220316; EP 3968459 A4 20230329; CN 113812040 A 20211217; CN 118232009 A 20240621; JP WO2020226049 A1 20201112; KR 20220003007 A 20220107; TW 202102072 A 20210101; US 2022201838 A1 20220623; WO 2020226049 A1 20201112
DOCDB simple family (application)
EP 20802964 A 20200421; CN 202080033584 A 20200421; CN 202410447213 A 20200421; JP 2020017139 W 20200421; JP 2021518337 A 20200421; KR 20217038342 A 20200421; TW 109115076 A 20200506; US 202017595006 A 20200421