Global Patent Index - EP 3972395 A4

EP 3972395 A4 20220727 - PRINTED CIRCUIT BOARD ASSEMBLY AND TERMINAL

Title (en)

PRINTED CIRCUIT BOARD ASSEMBLY AND TERMINAL

Title (de)

LEITERPLATTENANORDNUNG UND ENDGERÄT

Title (fr)

ENSEMBLE CARTE DE CIRCUIT IMPRIMÉ ET BORNE

Publication

EP 3972395 A4 20220727 (EN)

Application

EP 20832668 A 20200415

Priority

  • CN 201910548773 A 20190624
  • CN 2020084935 W 20200415

Abstract (en)

[origin: EP3972395A1] A printed circuit board assembly and a terminal are provided. The printed circuit board assembly includes: a first printed circuit board (1) and a second printed circuit board (2), where the second printed circuit board (2) is electrically connected to the first printed circuit board (1) through at least four solder joints (3, 4, 5, and 6); the at least four solder joints include a first solder joint (3), a second solder joint (4), a third solder joint (5), and a fourth solder joint (6), the first solder joint (3) communicates with the second solder joint (4), the third solder joint (5) communicates with the fourth solder joint (6), and at least one solder joint (7) and/or at least one printed circuit board cavity (8) is provided between the second solder joint (4) and the third solder joint (5); and the printed circuit board cavity (8) is a recess structure that is recessed inwards from a surface of the printed circuit board.

IPC 8 full level

H05K 1/14 (2006.01); H01L 23/00 (2006.01); H05K 3/36 (2006.01); H05K 3/34 (2006.01)

CPC (source: CN EP KR US)

H05K 1/0216 (2013.01 - US); H05K 1/14 (2013.01 - CN); H05K 1/144 (2013.01 - EP US); H05K 1/145 (2013.01 - CN KR); H05K 1/185 (2013.01 - KR); H05K 3/368 (2013.01 - EP); H05K 9/0022 (2013.01 - CN KR); H05K 3/3436 (2013.01 - EP); H05K 2201/041 (2013.01 - EP); H05K 2201/042 (2013.01 - EP US); H05K 2201/049 (2013.01 - EP); H05K 2201/09036 (2013.01 - EP); H05K 2201/09063 (2013.01 - EP); H05K 2201/094 (2013.01 - EP); H05K 2201/0949 (2013.01 - EP); H05K 2201/09609 (2013.01 - EP); H05K 2201/09627 (2013.01 - EP); H05K 2201/0979 (2013.01 - EP); H05K 2201/10378 (2013.01 - EP); H05K 2201/10734 (2013.01 - EP); H05K 2203/0465 (2013.01 - EP)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 3972395 A1 20220323; EP 3972395 A4 20220727; AU 2020305430 A1 20220120; AU 2020305430 B2 20230824; BR 112021024298 A2 20220111; CA 3143077 A1 20201230; CA 3143077 C 20240305; CN 110312363 A 20191008; CN 110312363 B 20201016; JP 2022533441 A 20220722; JP 7335980 B2 20230830; KR 102669585 B1 20240524; KR 20220002538 A 20220106; US 11778744 B2 20231003; US 2022104358 A1 20220331; WO 2020259016 A1 20201230

DOCDB simple family (application)

EP 20832668 A 20200415; AU 2020305430 A 20200415; BR 112021024298 A 20200415; CA 3143077 A 20200415; CN 201910548773 A 20190624; CN 2020084935 W 20200415; JP 2021569411 A 20200415; KR 20217038804 A 20200415; US 202117549679 A 20211213