EP 3977492 A4 20220810 - SURFACE-MOUNTED MAGNETIC-COMPONENT MODULE
Title (en)
SURFACE-MOUNTED MAGNETIC-COMPONENT MODULE
Title (de)
OBERFLÄCHENMONTIERTES MAGNETKOMPONENTENMODUL
Title (fr)
MODULE À COMPOSANT MAGNÉTIQUE MONTÉ EN SURFACE
Publication
Application
Priority
- US 201962871847 P 20190709
- US 2020041351 W 20200709
Abstract (en)
[origin: WO2021007404A1] A magnetic-component module includes a substrate including a recess on a first surface of the substrate, a core in the recess, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds.
IPC 8 full level
H01F 17/06 (2006.01); H01F 27/02 (2006.01); H01F 27/06 (2006.01); H01F 27/26 (2006.01); H01F 27/28 (2006.01)
CPC (source: CN EP)
H01F 17/062 (2013.01 - EP); H01F 27/022 (2013.01 - CN EP); H01F 27/24 (2013.01 - CN); H01F 27/266 (2013.01 - CN EP); H01F 27/2804 (2013.01 - CN EP); H01F 27/2895 (2013.01 - EP); H01F 27/292 (2013.01 - CN); H01F 2027/2814 (2013.01 - CN EP)
Citation (search report)
- [IA] WO 2011149523 A1 20111201 - TYCO ELECTRONICS CORP [US], et al
- [YA] WO 2016100988 A1 20160623 - TEXAS INSTRUMENTS INC [US], et al
- [YA] WO 2016100987 A1 20160623 - TEXAS INSTRUMENTS INC [US], et al
- [YA] US 4524342 A 19850618 - MAS JOSEPH [US]
- [A] US 2017222563 A1 20170803 - NOMA TAKASHI [JP], et al
- [A] US 2014085033 A1 20140327 - WEN YAO-LONG [TW]
- [A] US 2011291785 A1 20111201 - LIM SUNGMOOK [KR], et al
- [A] US 2007290783 A1 20071220 - WHITTAKER RONALD W [US], et al
- See references of WO 2021007404A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2021007404 A1 20210114; CN 114097049 A 20220225; EP 3977492 A1 20220406; EP 3977492 A4 20220810
DOCDB simple family (application)
US 2020041351 W 20200709; CN 202080049986 A 20200709; EP 20836917 A 20200709