EP 3978549 A4 20220720 - PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM THEREOF
Title (en)
PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM THEREOF
Title (de)
LICHTEMPFINDLICHE HARZZUSAMMENSETZUNG UND GEHÄRTETER FILM DARAUS
Title (fr)
COMPOSITION DE RÉSINE PHOTOSENSIBLE ET FILM DURCI À BASE DE CELLE-CI
Publication
Application
Priority
- JP 2019103475 A 20190603
- JP 2020021023 W 20200527
Abstract (en)
[origin: EP3978549A1] A photosensitive resin composition including a polyimide resin (A) having a specific structure and a weight average molecular weight of 70000 or less is provided.
IPC 8 full level
C08G 73/12 (2006.01); C08G 73/10 (2006.01); C08L 33/08 (2006.01); C08L 79/08 (2006.01); G03F 7/027 (2006.01); G03F 7/20 (2006.01)
CPC (source: CN EP KR US)
C08F 283/045 (2013.01 - EP); C08F 290/145 (2013.01 - EP); C08G 73/1007 (2013.01 - US); C08G 73/101 (2013.01 - EP); C08G 73/1039 (2013.01 - EP); C08G 73/1042 (2013.01 - EP); C08G 73/105 (2013.01 - EP); C08G 73/1075 (2013.01 - KR); C08G 73/1078 (2013.01 - EP); C08G 73/12 (2013.01 - EP); C08L 79/08 (2013.01 - EP KR); C08L 79/085 (2013.01 - EP); G03F 7/004 (2013.01 - CN); G03F 7/027 (2013.01 - CN EP); G03F 7/028 (2013.01 - KR US); G03F 7/037 (2013.01 - EP KR US); G03F 7/0757 (2013.01 - EP); G03F 7/09 (2013.01 - CN); C08G 2650/16 (2013.01 - US); C08G 2650/36 (2013.01 - US)
C-Set (source: EP)
Citation (search report)
- [X] JP 6051653 B2 20161227
- [XI] JP 2010070604 A 20100402 - HITACHI CHEMICAL CO LTD
- See also references of WO 2020246349A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
EP 3978549 A1 20220406; EP 3978549 A4 20220720; CN 113892058 A 20220104; CN 113892058 B 20240514; JP WO2020246349 A1 20201210; KR 20220016450 A 20220209; TW 202104370 A 20210201; US 2022252979 A1 20220811; WO 2020246349 A1 20201210
DOCDB simple family (application)
EP 20817747 A 20200527; CN 202080039858 A 20200527; JP 2020021023 W 20200527; JP 2021524798 A 20200527; KR 20217029743 A 20200527; TW 109117992 A 20200529; US 202017613565 A 20200527