Global Patent Index - EP 3983484 A1

EP 3983484 A1 20220420 - POLYAMIDE COMPOSITIONS HAVING A HIGH MODULUS AND A LOW DIELECTRIC CONSTANT AND USE THEREOF

Title (en)

POLYAMIDE COMPOSITIONS HAVING A HIGH MODULUS AND A LOW DIELECTRIC CONSTANT AND USE THEREOF

Title (de)

POLYAMIDZUSAMMENSETZUNGEN MIT HOHEM MODUL UND NIEDRIGER DIELEKTRIZITÄTSKONSTANTE UND IHRE VERWENDUNG

Title (fr)

COMPOSITIONS DE POLYAMIDE PRESENTANT UN MODULE ELEVE ET UNE FAIBLE CONSTANTE DIELECTRIQUE ET LEUR UTILISATION

Publication

EP 3983484 A1 20220420 (FR)

Application

EP 20743201 A 20200610

Priority

  • FR 1906183 A 20190611
  • FR 2020050986 W 20200610

Abstract (en)

[origin: WO2020249899A1] The present invention relates to the use of a mixture of solid and hollow glass reinforcements with an alloy consisting of at least one polyamide and at least one polyolefin, the mixture of solid and hollow glass reinforcements comprising from 5 to 50% by weight of hollow glass beads relative to the total of solid and hollow glass reinforcements, in particular from 5 to 35% by weight of hollow glass beads relative to the total of solid and hollow glass reinforcements, for the dry preparation at 23°C of a composition having a modulus at least equal to 8 GPa, in particular at least equal to 10 GPa, in particular at least equal to 11 GPa, and a dielectric constant Dk less than or equal to 3.5, in particular less than or equal to 3.3, in particular less than or equal to 3.2 as measured according to ASTM D-2520-13, at a frequency of at least 1 GHz, in particular at a frequency of at least 2 GHz, in particular at a frequency of at least 3 GHz, at 23°C, under 50% RH.

IPC 8 full level

C08L 77/00 (2006.01); B29C 45/00 (2006.01)

CPC (source: CN EP KR US)

B29C 45/0001 (2013.01 - US); B29C 45/0005 (2013.01 - US); C08K 7/14 (2013.01 - CN KR US); C08K 7/28 (2013.01 - CN KR US); C08L 23/10 (2013.01 - CN KR); C08L 51/06 (2013.01 - CN KR); C08L 77/00 (2013.01 - CN EP); C08L 77/06 (2013.01 - KR); B29C 45/0005 (2013.01 - EP); B29K 2023/12 (2013.01 - US); B29K 2077/00 (2013.01 - US); C08K 2201/014 (2013.01 - US)

C-Set (source: CN EP)

C08L 77/00 + C08L 23/10 + C08L 51/06 + C08K 7/14 + C08K 7/28

Citation (search report)

See references of WO 2020249899A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

WO 2020249899 A1 20201217; CN 114127182 A 20220301; EP 3983484 A1 20220420; FR 3097226 A1 20201218; FR 3097226 B1 20211126; JP 2022536159 A 20220812; KR 20220020343 A 20220218; US 2022306838 A1 20220929

DOCDB simple family (application)

FR 2020050986 W 20200610; CN 202080050562 A 20200610; EP 20743201 A 20200610; FR 1906183 A 20190611; JP 2021573363 A 20200610; KR 20227000674 A 20200610; US 202017617877 A 20200610