EP 3984066 A4 20230614 - METHOD FOR MANUFACTURING DISPLAY DEVICE AND SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE
Title (en)
METHOD FOR MANUFACTURING DISPLAY DEVICE AND SUBSTRATE FOR MANUFACTURING DISPLAY DEVICE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER ANZEIGEVORRICHTUNG UND SUBSTRAT ZUR HERSTELLUNG EINER ANZEIGEVORRICHTUNG
Title (fr)
PROCÉDÉ DE FABRICATION DE DISPOSITIF D'AFFICHAGE ET SUBSTRAT POUR FABRICATION DE DISPOSITIF D'AFFICHAGE
Publication
Application
Priority
- KR 20190068834 A 20190611
- KR 2020002304 W 20200218
Abstract (en)
[origin: US2020395345A1] The present disclosure relates to an assembly substrate used for a display device manufacturing method in which semiconductor light-emitting diodes are placed on the assembly substrate at preset positions using electric field and magnetic field. Specifically, the assembly substrate includes a base portion, a plurality of assembly electrodes extending in one direction and disposed on the base portion, a dielectric layer stacked on the base portion to cover the assembly electrodes, a barrier wall formed on the base portion and having a plurality of recesses for guiding the semiconductor light-emitting diodes to the preset positions, and a metal shielding layer formed on the base portion, wherein the metal shielding layer overlaps the barrier wall so that an electric field formed between the assembly electrodes is shielded.
IPC 8 full level
H01L 27/15 (2006.01); H01L 25/16 (2023.01); H01L 33/00 (2010.01); H01L 33/44 (2010.01); H01L 33/62 (2010.01)
CPC (source: EP KR US)
H01L 21/6835 (2013.01 - US); H01L 25/0753 (2013.01 - EP US); H01L 25/167 (2013.01 - KR); H01L 27/156 (2013.01 - KR); H01L 33/0093 (2020.05 - KR US); H01L 33/0095 (2013.01 - EP KR); H01L 33/44 (2013.01 - KR); H01L 33/62 (2013.01 - KR US); H01L 21/67144 (2013.01 - EP); H01L 2221/68354 (2013.01 - US); H01L 2221/68363 (2013.01 - US); H01L 2224/95101 (2013.01 - EP); H01L 2933/0066 (2013.01 - US)
Citation (search report)
- [A] US 2018219138 A1 20180802 - SASAKI KENJI [US], et al
- [A] US 2018102352 A1 20180412 - SASAKI KENJI [US], et al
- See references of WO 2020251136A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
US 11211366 B2 20211228; US 2020395345 A1 20201217; EP 3984066 A1 20220420; EP 3984066 A4 20230614; KR 20200026673 A 20200311; US 11798921 B2 20231024; US 2022077122 A1 20220310; WO 2020251136 A1 20201217
DOCDB simple family (application)
US 202016834315 A 20200330; EP 20823237 A 20200218; KR 20190068834 A 20190611; KR 2020002304 W 20200218; US 202117530155 A 20211118