EP 3987587 A1 20220427 - FORMULATION COMPRISING A P-TYPE ORGANIC SEMICONDUCTOR MATERIAL AND AN N-TYPE SEMICONDUCTOR MATERIAL
Title (en)
FORMULATION COMPRISING A P-TYPE ORGANIC SEMICONDUCTOR MATERIAL AND AN N-TYPE SEMICONDUCTOR MATERIAL
Title (de)
FORMULIERUNG AUS EINEM ORGANISCHEN HALBLEITERMATERIAL VOM TYP P UND EINEM HALBLEITERMATERIAL VOM TYP N
Title (fr)
FORMULATION COMPRENANT UN MATERIAU SEMICONDUCTEUR ORGANIQUE DE TYPE P ET UN MATERIAU SEMICONDUCTEUR DE TYPE N
Publication
Application
Priority
- FR 1906820 A 20190624
- EP 2020067378 W 20200622
Abstract (en)
[origin: WO2020260212A1] The present description relates to a formulation comprising a p-type organic semiconductor polymer comprising a conjugated aryl compound, a conjugated heteroaryl compound or a mixture of two or more of these compounds; an n-type semiconductor material comprising fullerene, substituted fullerene or a mixture of two or more of these compounds; a non-aqueous solvent, wherein the concentration of the p-type organic semiconductor polymer is 12 mg/mL to 17 mg/mL per milliliter of solvent, and the concentration of the p-type organic semiconductor material is 24 mg/mL to 28 mg/mL per milliliter of solvent.
IPC 8 full level
H10K 99/00 (2023.01)
CPC (source: EP KR US)
H10K 30/30 (2023.02 - EP KR US); H10K 50/00 (2023.02 - US); H10K 71/15 (2023.02 - EP KR US); H10K 85/113 (2023.02 - KR US); H10K 85/215 (2023.02 - KR US); H10K 39/30 (2023.02 - EP KR); H10K 85/113 (2023.02 - EP); H10K 85/211 (2023.02 - EP); Y02E 10/549 (2013.01 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
FR 3097684 A1 20201225; FR 3097684 B1 20210625; EP 3987587 A1 20220427; JP 2022539124 A 20220907; KR 20220024535 A 20220303; TW M619758 U 20211121; US 2022359825 A1 20221110; WO 2020260212 A1 20201230
DOCDB simple family (application)
FR 1906820 A 20190624; EP 2020067378 W 20200622; EP 20733627 A 20200622; JP 2021577165 A 20200622; KR 20227001223 A 20200622; TW 109207949 U 20200623; US 202017622532 A 20200622