EP 3987588 A1 20220427 - FORMULATION COMPRISING A P-TYPE ORGANIC SEMICONDUCTOR MATERIAL AND AN N-TYPE SEMICONDUCTOR MATERIAL
Title (en)
FORMULATION COMPRISING A P-TYPE ORGANIC SEMICONDUCTOR MATERIAL AND AN N-TYPE SEMICONDUCTOR MATERIAL
Title (de)
FORMULIERUNG AUS EINEM ORGANISCHEN HALBLEITERMATERIAL VOM TYP P UND EINEM HALBLEITERMATERIAL VOM TYP N
Title (fr)
FORMULATION COMPRENANT UN MATERIAU SEMICONDUCTEUR ORGANIQUE DE TYPE P ET UN MATERIAU SEMICONDUCTEUR DE TYPE N
Publication
Application
Priority
- FR 1906822 A 20190624
- EP 2020067381 W 20200622
Abstract (en)
[origin: WO2020260214A1] The present description relates to a formulation comprising a p-type organic semiconductor polymer comprising a conjugated aryl compound, a conjugated heteroaryl compound or a mixture of two or more of these compounds; an n-type semiconductor material comprising fullerene, substituted fullerene or a mixture of two or more of these compounds; and a non-aqueous solvent, wherein the concentration of the p-type organic semiconductor polymer is 4 mg/mL to 8 mg/mL per milliliter of solvent, and the concentration of the n-type organic semiconductor material is 10 mg/mL to 14 mg/mL per milliliter of solvent.
IPC 8 full level
H01L 51/42 (2006.01); H01L 51/46 (2006.01)
CPC (source: EP KR US)
C09D 11/033 (2013.01 - KR US); C09D 11/102 (2013.01 - KR US); H10K 30/30 (2023.02 - US); H10K 71/15 (2023.02 - EP KR US); H10K 85/113 (2023.02 - EP KR US); H10K 85/215 (2023.02 - EP KR US); H10K 30/30 (2023.02 - EP KR); H10K 30/50 (2023.02 - EP KR); H10K 2102/361 (2023.02 - US); Y02E 10/549 (2013.01 - EP); Y02P 70/50 (2015.11 - EP)
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
FR 3097686 A1 20201225; FR 3097686 B1 20221028; EP 3987588 A1 20220427; JP 2022538858 A 20220906; KR 20220024479 A 20220303; TW M620350 U 20211201; US 2022359842 A1 20221110; WO 2020260214 A1 20201230
DOCDB simple family (application)
FR 1906822 A 20190624; EP 2020067381 W 20200622; EP 20733629 A 20200622; JP 2021577168 A 20200622; KR 20227000887 A 20200622; TW 109207962 U 20200623; US 202017622654 A 20200622