Global Patent Index - EP 3990537 A1

EP 3990537 A1 20220504 - PRESSURE-SENSITIVE ADHESIVE COMPOUND WITH HIGH FILLER CONTENT

Title (en)

PRESSURE-SENSITIVE ADHESIVE COMPOUND WITH HIGH FILLER CONTENT

Title (de)

HAFTKLEBMASSE MIT HOHEM FÜLLSTOFFANTEIL

Title (fr)

COMPOSITION ADHÉSIVE DE CONTACT COMPORTANT UNE PROPORTION ÉLEVÉE DE CHARGES

Publication

EP 3990537 A1 20220504 (DE)

Application

EP 20737382 A 20200629

Priority

  • DE 102019209571 A 20190628
  • EP 2020068310 W 20200629

Abstract (en)

[origin: WO2020260719A1] The aim of the invention is to devise a pressure-sensitive adhesive compound which has a wide spectrum of bonding performance, can be efficiently produced and in particular has an excellent thermal conductivity. The compound should possibly also have electrically insulating properties. For this purpose, a pressure-sensitive adhesive compounds contains a. at least one poly(meth)acrylate; and b. at least 40 vol.%, relative to the total volume of the pressure-sensitive adhesive compound, of a mixture of at least two fillers, and is characterized in that the mixture of at least two fillers includes at least one filler Fisph that consists of substantially spherical particles. The invention also relates to the use of a pressure-sensitive adhesive compound according to the invention for conducting heat.

IPC 8 full level

C08K 7/18 (2006.01); C09J 9/00 (2006.01); C09J 133/08 (2006.01)

CPC (source: CN EP US)

C08K 3/22 (2013.01 - US); C08K 3/38 (2013.01 - US); C08K 7/18 (2013.01 - EP US); C09J 7/385 (2017.12 - US); C09J 9/00 (2013.01 - CN EP); C09J 11/04 (2013.01 - CN US); C09J 133/08 (2013.01 - CN EP US); C08K 2003/2227 (2013.01 - CN EP US); C08K 2003/382 (2013.01 - EP); C08K 2003/385 (2013.01 - CN US); C08K 2201/003 (2013.01 - US); C08K 2201/005 (2013.01 - CN EP); C09J 2301/302 (2020.08 - CN EP US); C09J 2301/314 (2020.08 - CN EP US); C09J 2301/408 (2020.08 - CN EP US); C09J 2400/10 (2013.01 - CN EP US); C09J 2433/00 (2013.01 - CN EP US); Y02E 60/10 (2013.01 - EP)

C-Set (source: CN EP)

C09J 133/08 + C08K 3/22 + C08K 3/38

Citation (search report)

See references of WO 2020260719A1

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

DE 102019209571 A1 20201231; CN 114008158 A 20220201; EP 3990537 A1 20220504; US 2022259464 A1 20220818; WO 2020260719 A1 20201230

DOCDB simple family (application)

DE 102019209571 A 20190628; CN 202080047128 A 20200629; EP 2020068310 W 20200629; EP 20737382 A 20200629; US 202017622989 A 20200629