EP 3998370 A1 20220518 - GALLIUM NITRIDE-BASED FILM AND METHOD FOR MANUFACTURING SAME
Title (en)
GALLIUM NITRIDE-BASED FILM AND METHOD FOR MANUFACTURING SAME
Title (de)
GALLIUMNITRIDBASIERTE FILME UND VERFAHREN ZUR HERSTELLUNG DAVON
Title (fr)
FILM A BASE DE NITRURE DE GALLIUM ET SON PROCEDE DE FABRICATION
Publication
Application
Priority
- JP 2015069913 A 20150330
- JP 2015089571 A 20150424
- JP 2015150959 A 20150730
- JP 2015152855 A 20150731
- EP 16772532 A 20160324
- JP 2016059341 W 20160324
Abstract (en)
The object of the present invention is to provide a sputtering target for a gallium nitride thin film, which has a low oxygen content, a high density and a low resistivity.A gallium nitride powder having powder physical properties of a low oxygen content and a high bulk density is used and hot pressing is conducted at high temperature in high vacuum to prepare a gallium nitride sintered body having a low oxygen content, a high density and a low resistivity.
IPC 8 full level
C23C 14/34 (2006.01); C01B 21/06 (2006.01); C04B 35/58 (2006.01); C23C 14/06 (2006.01); C30B 23/02 (2006.01); C30B 25/20 (2006.01); C30B 29/38 (2006.01); C30B 29/40 (2006.01); C30B 29/68 (2006.01); H01J 37/34 (2006.01)
CPC (source: CN EP KR US)
C01B 21/0632 (2013.01 - EP US); C04B 35/58 (2013.01 - CN EP KR US); C04B 35/622 (2013.01 - CN); C04B 35/645 (2013.01 - CN KR); C23C 14/0641 (2013.01 - CN KR US); C23C 14/34 (2013.01 - EP US); C23C 14/3414 (2013.01 - CN KR US); C30B 23/025 (2013.01 - CN US); C30B 25/20 (2013.01 - US); C30B 29/38 (2013.01 - EP US); C30B 29/406 (2013.01 - CN US); C30B 29/68 (2013.01 - CN US); H01J 37/3426 (2013.01 - CN EP US); C01P 2006/10 (2013.01 - US); C01P 2006/40 (2013.01 - US); C01P 2006/80 (2013.01 - US); C04B 2235/6581 (2013.01 - CN); C04B 2235/77 (2013.01 - CN KR); C04B 2235/785 (2013.01 - KR); C04B 2235/786 (2013.01 - CN KR); C04B 2235/96 (2013.01 - KR)
Citation (applicant)
- JP H11172424 A 19990629 - MINOLTA CO LTD
- JP 2005508822 A 20050407
- JP 2012144424 A 20120802 - TOSOH CORP
- JP 2014159368 A 20140904 - TOSOH CORP
- JP 2014091851 A 20140519 - TOSOH CORP
- JP 2002003297 A 20020109 - FUJI ELECTRIC CO LTD
- JP 2004111883 A 20040408 - TOKYO INST TECH, et al
- JP 2015069913 A 20150413 - MITSUBISHI MATERIALS CORP
- JP 2015089571 A 20150511 - WANG CHENG-PING
- JP 2015150959 A 20150824 - MITSUBISHI MOTORS CORP
- JP 2015152855 A 20150824 - RICOH CO LTD
Citation (search report)
- [A] US 2006163605 A1 20060727 - MIYAHARA KENICHIRO [JP]
- [A] US 2004094756 A1 20040520 - MOON YONG TAE [KR], et al
- [A] DATABASE WPI Week 199937, Derwent World Patents Index; AN 1999-432879, XP002806137
- [A] DATABASE WPI Week 201431, Derwent World Patents Index; AN 2014-G99174, XP002806138
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
EP 3279367 A1 20180207; EP 3279367 A4 20181010; EP 3279367 B1 20211201; CN 107429383 A 20171201; CN 107429383 B 20200724; CN 111826618 A 20201027; CN 111826618 B 20221101; EP 3998370 A1 20220518; EP 3998370 B1 20240724; KR 102679764 B1 20240628; KR 20170132745 A 20171204; TW 201700437 A 20170101; TW I668198 B 20190811; US 11802049 B2 20231031; US 2018072570 A1 20180315; US 2022153582 A1 20220519; WO 2016158651 A1 20161006
DOCDB simple family (application)
EP 16772532 A 20160324; CN 201680015322 A 20160324; CN 202010696987 A 20160324; EP 21208680 A 20160324; JP 2016059341 W 20160324; KR 20177026289 A 20160324; TW 105109830 A 20160329; US 201615562112 A 20160324; US 202217590120 A 20220201