EP 4003249 A1 20220601 - DEVICE AND METHOD FOR PROCESSING MATERIAL BY MEANS OF LASER RADIATION
Title (en)
DEVICE AND METHOD FOR PROCESSING MATERIAL BY MEANS OF LASER RADIATION
Title (de)
VORRICHTUNG UND VERFAHREN ZUR MATERIALBEARBEITUNG MITTELS LASERSTRAHLUNG
Title (fr)
DISPOSITIF ET PROCÉDÉ POUR LE TRAITEMENT DE MATIÈRE AU MOYEN D'UN RAYONNEMENT LASER
Publication
Application
Priority
- DE 102019120010 A 20190724
- EP 2020070453 W 20200720
Abstract (en)
[origin: CA3148493A1] The invention relates to a method for processing material, in particular for modifying material and/or material properties, by means of laser radiation, comprising the following steps: a) generating a multiplicity of laser pulses (L); b) controlling the point of impact of the laser pulses (L) on a workpiece (100) to be processed, in particular deflecting the laser pulses (L) and/or moving the workpiece (100) to be processed, such that the laser pulses (L) are guided along a predetermined trajectory (Z) on the workpiece (100) to be processed. According to the invention, - a pulse-to-pulse time interval (?t) between the individual laser pulses (L) generated and/or - a pulse energy (Pi) of the laser pulses (L) and/or - a beam diameter (D) of the laser pulses (D) and/or - the predetermined trajectory (Z) is/are specifically subjected to noise.
IPC 8 full level
A61F 9/008 (2006.01); B23K 26/0622 (2014.01)
CPC (source: EP US)
A61F 9/00825 (2013.01 - EP); B23K 26/0624 (2015.10 - EP US); B23K 26/082 (2015.10 - EP US); B23K 26/36 (2013.01 - EP); A61F 2009/00872 (2013.01 - EP); A61F 2009/00897 (2013.01 - EP); B23K 26/0648 (2013.01 - US); B23K 26/40 (2013.01 - US)
Citation (search report)
See references of WO 2021013796A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
DE 102019120010 A1 20210128; CA 3148493 A1 20210128; EP 4003249 A1 20220601; JP 2022541631 A 20220926; US 2022258279 A1 20220818; WO 2021013796 A1 20210128; WO 2021013796 A9 20210318
DOCDB simple family (application)
DE 102019120010 A 20190724; CA 3148493 A 20200720; EP 2020070453 W 20200720; EP 20746134 A 20200720; JP 2022504533 A 20200720; US 202017628551 A 20200720