EP 4025379 A1 20220713 - SOLDER ALLOY AND SOLDER PASTE CONTAINING SAID ALLOY
Title (en)
SOLDER ALLOY AND SOLDER PASTE CONTAINING SAID ALLOY
Title (de)
LÖTLEGIERUNG UND LÖTPASTE MIT DIESER LEGIERUNG
Title (fr)
ALLIAGE DE BRASAGE ET PÂTE À BRASER CONTENANT LEDIT ALLIAGE
Publication
Application
Priority
- EP 19195895 A 20190906
- EP 2020074193 W 20200831
Abstract (en)
[origin: WO2021043708A1] The present invention relates to a lead-free solder alloy which consists essentially of or consists of: from 0.01 to 11 wt.% of zinc (Zn); from 0.01 to 6 wt.% of bismuth (Bi); from 0.01 to 2 wt.% of gallium (Ga); and, tin (Sn), wherein said weight percentages are based on the total weight of the alloy. The invention is also directed to a solder paste comprising the defined lead-free solder alloy in particulate form and a solder flux.
IPC 8 full level
B23K 35/26 (2006.01); B23K 35/02 (2006.01); C22C 13/00 (2006.01); H05K 3/34 (2006.01)
CPC (source: EP)
B23K 35/025 (2013.01); B23K 35/262 (2013.01); C22C 13/00 (2013.01); H05K 3/3463 (2013.01); H05K 3/3485 (2020.08)
Citation (search report)
See references of WO 2021043708A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated extension state (EPC)
BA ME
DOCDB simple family (publication)
WO 2021043708 A1 20210311; CN 114340836 A 20220412; EP 4025379 A1 20220713
DOCDB simple family (application)
EP 2020074193 W 20200831; CN 202080062342 A 20200831; EP 20761287 A 20200831