EP 4029670 A1 20220720 - DEVICE AND METHOD FOR CUTTING A SOLID SUBSTRATE

Title (en)

DEVICE AND METHOD FOR CUTTING A SOLID SUBSTRATE

Title (de)

VORRICHTUNG UND VERFAHREN ZUM SCHNEIDEN EINES FESTEN SUBSTRATS

Title (fr)

DISPOSITIF ET PROCÉDÉ POUR COUPER UN SUBSTRAT SOLIDE

Publication

EP 4029670 A1 20220720 (EN)

Application

EP 21151771 A 20210115

Priority

EP 21151771 A 20210115

Abstract (en)

The invention pertains to a device for cutting a solid substrate, preferably a solid semiconductor substrate for use as wafer material, comprising at least two guiding rollers and a cutting wire guided by the at least two guiding rollers forming a wire web between them, and comprising moving means for effecting a relative movement between a solid substrate and the guiding rollers to introduce the solid substrate into the wire web for cutting the solid substrate into a multitude of substrate slices, wherein the wire web is of sufficient size to allow cutting of a solid substrate with a cross section extension of at least 25 cm, wherein the device comprises at least three guiding rollers arranged preferably in triangular form wherein the cutting wire is guided by the at least three guiding rollers and the solid substrate can be introduced by the moving means into the wire web between a first guiding roller and a second guiding roller of the at least three guiding rollers for cutting, and wherein the device comprises pivoting means for alternately pivoting the solid substrate about a longitudinal axis of the solid substrate during cutting and/or for alternately pivoting the guiding rollers about a common axis parallel to their longitudinal axes during cutting. The invention further pertains to a corresponding method.

IPC 8 full level

B28D 5/04 (2006.01); B28D 5/00 (2006.01)

CPC (source: EP)

B28D 5/0088 (2013.01); B28D 5/045 (2013.01)

Citation (applicant)

WO 2014087340 A2 20140612 - MEYER BURGER AG [CH]
WO 2018149631 A1 20180823 - SILTRONIC AG [DE]
WO 2019130806 A1 20190704 - SHINETSU HANDOTAI KK [JP]
WO 2019220820 A1 20191121 - SHINETSU HANDOTAI KK [JP]
DE 112018001068 T5 20191114 - SHINETSU HANDOTAI KK [JP]
DE 102018221900 A1 20200618 - SILTRONIC AG [DE]
DE 102018221921 A1 20200618 - SILTRONIC AG [DE]
JP 2000158436 A 20000613 - IWAKI KIKAI SEKKEI JIMUSHO KK
WO 2010009881 A1 20100128 - MEYER BURGER AG [CH], et al

Citation (search report)

[X] US 2010006082 A1 20100114 - GLINSKI LUKASZ A [US], et al
[X] WO 9902295 A2 19990121 - LASER TECHNOLOGY WEST LIMITED [US]
[X] EP 2633936 A1 20130904 - MEYER BURGER AG [CH]
[A] US 5842462 A 19981201 - SCHMID FREDERICK [US], et al
[A] EP 2777903 A1 20140917 - APPLIED MATERIALS SWITZERLAND S RL [CH]
[A] DE 102004011991 A1 20050929 - SILTRONIC AG [DE]

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

Designated extension state (EPC)

BA ME

DOCDB simple family (publication)

EP 4029670 A1 20220720; WO 2022152606 A1 20220721

DOCDB simple family (application)

EP 21151771 A 20210115; EP 2022050141 W 20220105