EP 4059047 A4 20240103 - AN APPARATUS AND METHOD FOR THE MINIMIZATION OF UNDERCUT DURING A UBM ETCH PROCESS
Title (en)
AN APPARATUS AND METHOD FOR THE MINIMIZATION OF UNDERCUT DURING A UBM ETCH PROCESS
Title (de)
VORRICHTUNG UND VERFAHREN ZUR MINIMIERUNG DER UNTERHÖHLUNG WÄHREND EINES UBM-ÄTZVERFAHRENS
Title (fr)
APPAREIL ET PROCÉDÉ DE RÉDUCTION AU MINIMUM DE GRAVURE SOUS-JACENTE LORS D'UN TRAITEMENT DE GRAVURE D'UBM
Publication
Application
Priority
- US 201916685640 A 20191115
- US 2020058479 W 20201102
Abstract (en)
[origin: WO2021096712A1] A plurality of endpoints in a wet etching process of a substrate are determined. A plurality of benchmark end points during a wet etching process of a first substrate are determined, using first light information represented by a HSV color model for sample locations of the first substrate. Etch parameters are generated for a wet etching process for a second substrate. The generated etch parameters are used with second light information represented by at least one value of the Hue, Saturation, Value color model associated with a plurality of sample locations of the second substrate to reach respective end points during the wet etching process of a second substrate.
IPC 8 full level
H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/3213 (2006.01); H01L 23/485 (2006.01)
CPC (source: EP)
H01L 21/67051 (2013.01); H01L 21/67253 (2013.01); H01L 22/26 (2013.01); H01L 24/00 (2013.01); H01L 21/32134 (2013.01); H01L 2224/13 (2013.01)
Citation (search report)
- [IAY] US 2014242731 A1 20140828 - MAUER LAURA [US], et al
- [A] US 2018061032 A1 20180301 - BENVEGNU DOMINIC J [US]
- [A] US 2012114220 A1 20120510 - SROCKA BERND [DE], et al
- [A] US 2009046922 A1 20090219 - YOSHIKAWA TORU [JP]
- [A] US 2004208359 A1 20041021 - PISHVA DAVAR [JP]
- [Y] CHALUPA ADAM ET AL: "Using High-Speed Video Analysis for Defect Investigation and Process Improvement", 2019 30TH ANNUAL SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE (ASMC), IEEE, 6 May 2019 (2019-05-06), pages 1 - 4, XP033592203, DOI: 10.1109/ASMC.2019.8791795
- See references of WO 2021096712A1
Designated contracting state (EPC)
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
DOCDB simple family (publication)
WO 2021096712 A1 20210520; EP 4059047 A1 20220921; EP 4059047 A4 20240103; TW 202135187 A 20210916
DOCDB simple family (application)
US 2020058479 W 20201102; EP 20887509 A 20201102; TW 109138896 A 20201106